Technical Information - Metallographic Polishing

Metallographic Final Polishing Abrasives

Final Polishing Abrasives


[ Order  Form ] Selection Guidelines ] Nanometer Alumina ] Colloidal Silica ] Trouble Shooting ] Product Description ] [ Home ]



FINE POLISHING ABRASIVES

Nanometer Alumina

Final polishing abrasives are selected based upon specimen hardness and chemical reactivity. The most common polishing abrasives are alumina and colloidal silica. Alumina abrasives are primarily used as mechanical abrasives because of their high hardness and durability. They also exist in either the softer gamma (mohs 8) or harder alpha (mohs 9) phases.

Colloidal Silica

Colloidal silica's are relatively soft final polishing abrasives with a high chemical activity. They are ideal for chemical mechanical polishing (CMP). The chemical activity of colloidal silica results from the electrochemical balance (zeta potential) required to keep the fine particles from aggregating. This chemical balance produces a surface phenomena which makes the specimen surface more reactive. This reacted layer is consequently removed by the colloidal silica abrasives themselves or by a mechanical scrubbing of the surface with other abrasives and/or the polishing pad.

Return to top


NANOMETER ALPHA ALUMINA DESCRIPTION

Nanometer alumina is a colloidal alumina processed by a proprietary process which produces a polycrystalline alumina crystal. This processing offers two significnat improvements over conventional alumina calcining processes:

  1. Tighter more controlled particle size distributions
  2. Harder alpha alumina phase

A tighter more controlled particle size distribution is a result of less particle aggregation. For example, standard calcined 0.05 um gamma alumina products form aggregate sizes as large as 5 um. These aggregates can be broken down during polishing with harder specimens. However, these large aggregates have been known to cause significant scratching in soft metals such as aluminum, tin, lead, copper and soft steels.

Nanometer alumina is specifically milled to produce a much smaller aggregate particle size distribution (<0.5 um). Nanometer alumina is also the harder alpha alumina particle, therefore making it a more efficient cutting abrasive. Thus nanometer alumina is a much more controlled polishing abrasive than calcined gamma alumina.

Advantages and Features of Nanometer Alumina
  • Improved surface finishes over gamma alumina
  • Less random scratching
  • Higher cutting rates than gamma alumina
  • Much more uniform surface finish
  • Tighter particle size distributions than gamma alumina
  • Low viscosity for easy dispensing
  • Semi-permanent suspensions
Application of Nanometer Alumina
  • The most efficient application is to initially wet the polishing cloth with Nanometer alumina and then to slowly drip or spray the suspension onto the polishing cloth
  • It is recommended that water be continuously applied to the polishing cloth for several seconds prior to completion of the polishing step. This aids in removing the fine particles which may be electrostatically attracted to the specimen surface. This phenomena occurs because of the deagglomeration characteristics of the alumina.
Return to top

COLLODIAL SILICA DESCRIPTION

Colloidal silica is a very unique polishing suspension because it provides a chemical mechanical polishing (CMP) action for materials such as ceramics, composites and soft metals. Colloidal silica has particle size distribution between 0.05 um and 0.07 um and is stabilized at alkaline pH values (typically >9.5).

Ceramics and Minerals - At higher pH values colloidal silica is held in nearly perfect suspension by the electrochemical repulsive forces of the fine particles themselves. This chemical balance electrochemcially attacks the surface of a ceramic or mineral surface to form a thin reacted layer on the specimen surface. This reacted layer can then be removed via the mechanical action of the polishing cloth or another abrasive (e.g. diamond). Polishing rates and surface finishes are significantly better for ceramics and minerals as compared with straight mechanical abrasives such as diamond. Thus the highest removal rates and the most reliable action for removing both surface and subsurface damage on ceramics and minerals is via chemical mechanical polishing with colloidal silica.

As with other exothermic chemical reactions the chemical contribution can be enhanced by increasing the temperature of the polishing action. This can be accomplished by increasing the polishing pressure which increases the friction between the polishing cloth, colloidal silica and the specimen.

Cleaning of the surface is best accomplished by running water on the surface for the final 10-15 seconds of the polishing cycle and then immediately rinsing the specimen surface with water. This allows the cloth to mechanically remove the reacted layer and any residual colloidal silica.

Application of Colloidal Silica
  • The most efficient application is to initially wet the polishing cloth with SIAMAT Colloidal Silica and then to slowly drip or spray the suspension onto the polishing cloth
  • It is recommended that water be applied continuously to the polishing cloth for 10-15 seconds prior to completion of the polishing step. This aids in removing the fine particles which may be electrostatically attracted to the specimen surface.
Return to top

TROUBLE SHOOTING GUIDE for NANOMETER ALUMINA

Symptom

Cause

Action

Agglomerate particles

  • Bacterial growth in suspending agent
  • Replace product
  • Specimen has a fine matte like finish

  • Thin layer of particles on the surface
  • Clean surface with 100% cotton swab and alcohol
  • Clean specimen by flushing specimen and polishing pad with water for last 10-15 seconds of the polishing operation
  • Excessive relief in surface finish

  • Overpolishing
  • Repeat step prior to final polish and shorten final polishing time
  • Scratches in specimen

  • Improper selection of polishing pad
  • Contaminated pad
  • Removal of secondary phases
  • Review application guideline chart for polishing pads or select a softer pad
  • Replace polishing pad
  • Alternate between polishing and etching
  • Etching of specimen

  • Alumina abrasive pH too high
  • Use lower pH alternative abrasives

  • Return to top

    TROUBLE SHOOTING GUIDE for COLLOIDAL SILICA

    Symptom

    Cause

    Action

    Crystallized residue on specimens

    Improper cleaning of specimen

    Repolish specimens and apply rinse water to pad and specimen for last 10-15 seconds

    Etching of specimen

    Too high a polishing pH

    Use an alternative polishing suspension

    Excessive scratching on specimen

    Crystallization of silica

    Keep bottle closed when not in use and filter colloidal silica through a filtering cloth


    Return to top

    FINE ABRASIVES PRODUCT SELECTION GUIDE

    ALUMINA Abrasive Slurry (pH 10)

    Description

    Quantity

    Catalog Number

    Nanometer 0.05 um micron
    Alpha alumina

    16 oz
    (0.475 ml)

    NA-1005-16

    Nanometer 0.05 um micron
    Alpha alumina

    64 oz
    (1.9 l)

    NA-1005-64

    Nanometer 0.05 um micron
    Alpha alumina

    128 oz
    (3.8 l)

    NA-1005-128


    ALUMINA Abrasive Slurry (Acidic-pH 4)

    Description

    Quantity

    Catalog Number

    Nanometer Acid Alumina Slurry
    (0.05 micron)

    16 oz
    (0.475 ml)

    NA-1020-16

    Nanometer Acid Alumina Slurry
    (0.05 micron)

    64 oz
    (1.9 l)

    NA-1020-64

    Nanometer Acid Alumina Slurry
    (0.05 micron)

    128 oz
    (3.8 l)

    NA-1020-128


    ALUMINA Abrasive Suspension

    Description

    Quantity

    Catalog Number

    NANOPOLISH 0.05 um micron suspension

    6 oz
    (0.475 ml)

    NANO-1005-06

    NANOPOLISH 0.30 um micron suspension

    6 oz
    (0.475 ml)

    NANO-1003-06

    NANOPOLISH 0.5 um micron suspension

    6 oz
    (0.475 ml)

    NANO-1105-06

    NANOPOLISH 1.0 um micron suspension

    6 oz
    (0.475 ml)

    NANO-1010-06

    NANOPOLISH 5.0 um micron suspension

    6 oz
    (0.475 ml)

    NANO-1050-06


    Fine ALUMINA Polishing Powders

    Description

    Quantity

    Catalog Number

    0.05 um Alumina Powder

    1 lb
    5 lbs

    ALP-0105-01
    ALP-0105-05

    0.3 um Alumina Powder (high density)

    1 lb
    5 lbs

    ALP-0103-01
    ALP-0103-05

    0.3 um Alumina Powder (Deagglomerated)

    1 lb
    5 lbs

    ALD-0103B-01
    ALD-0103B-05

    0.5 um Alumina Powder

    5 lbs

    ALR-0150-05

    1.0 um Alumina Powder

    1 lb
    5 lbs

    ALR-0110-01
    ALR-0110-05

    3 um Alumina Powder

    5 lbs

    ALR-0130-05

    5.0 um Alumina Powder

    5 lbs

    ALR-0150-05


    Coarse ALUMINA Powders

    Description

    Quantity

    Catalog Number

    240 grit Alumina Suspension

    5 lbs

    ALR-0240-05

    400 grit Alumina Suspension

    5 lbs

    ALR-0400-05

    600 grit Alumina Suspension

    5 lbs

    ALR-0600-05


    Colloidal Silica (0.05 micron)

    Description

    Quantity

    Catalog Number

    SIAMAT Colloidal Silica

    16 oz
    (500 ml)

    SI-100A-16

    SIAMAT Colloidal Silica

    64 oz
    (1.9 l)

    SI-100A-64

    SIAMAT Colloidal Silica

    128 oz
    (3.8 l)

    SI-100A-128


    Colloidal Silica (0.02 micron)

    Description

    Quantity

    Catalog Number

    SIAMAT2 Colloidal Silica

    16 oz
    (500 ml)

    SI2-100A-16

    SIAMAT2 Colloidal Silica

    64 oz
    (1.9 l)

    SI2-100A-64

    SIAMAT2 Colloidal Silica

    128 oz
    (3.8 l)

    SI2-100A-128


    Return to top
    About Us | Site Map | Disclaimer and Legal Information | Contact Us

    Copyright © 2006
    Pace Technologies, Inc. - 1802 W. Grant Rd. No. 102 - Tucson, AZ 85745 USA
    Telephone 520-882-6598 FAX 520-882-6599.
    All Rights Reserved.