The preparation of hard/brittle/porous ceramic materials is not especially difficult with a few simple preparation tricks. First, to minimize grain pull-out which may be falsely characterized as porosity sectioning damage must be minimized. This is accomplished by sectioning with the appropriate diamond wafering blade and using the finest practical abrasive for initial grinding. Planar grinding is best achieved with the use of as small a diamond abrasive as possible on a metal mesh cloth. Note there is a trade-off between planar grinding time (abrasive size) and induced damage. In some cases for ceramics, it is better to take more time and minimize damage at planar grinding in order to reduce overall polishing times. The use of SIAMAT colloidal silica also provides a chemical mechanical polishing (CMP) action which is the most effective means for eliminating both surface and subsurface damage. The combination of SIAMAT colloidal silica with DIAMAT polycrystalline diamond also produces the required surfaces finishes.
SECTIONING
Diamond Wafering blade - medium grit / low concentration
MOUNTING
Castable Mounting with Epoxy or Acrylic resins
POLISHING
|
Abrasive/surface |
Lubricant |
Pressure/ sample |
Time |
|
30 um DIAMAT diamond on CERMESH metal mesh cloth |
DIALUBE Extender |
10-12 psi |
5-10 minutes |
|
6 um DIAMAT diamond on POLYPAD pad |
SIAMAT colloidal silica |
10-12 psi |
5-10 minutes |
|
1 um DIAMAT diamond on DACRON pad |
SIAMAT colloidal silica |
10-12 psi |
5 minutes |
|
SIAMAT Colloidal silica on TEXPAN pad |
|
10-12 psi |
5-10 minutes |
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