Metallographic Wafering Blades

USA Product Catalog - Wafering Blades


Our address: Pace Technologies 1802 W. Grant Rd. Suite 102 Tucson, AZ 85745 USA	Contact details: Phone: 888-PACE-654 Fax: 520-882-6599 E_mail: PACE@metallographic.com

If the item of interest or the size of the item is not shown, please request a specials quote by clicking on the following link.

3-inch Diameter (76.2 mm) Wafering Blade, 1/2 inch (12.7 mm) Arbor x 0.006 inch thick

Application/ Description	Price	Cat. No.
Brittle materials (microelectronics, friable ceramics, minerals) Low concentration/fine grit diamond	$185.00	WB-0030LC
Hard tougher ceramics (silicon nitride, zirconia) Low concentration/ medium grit diamond	$185.00	WB-0035LC
Most metal samples High concentration/ medium grit diamond	$185.00	WB-0035HC

4-inch Diameter (102 mm) Wafering Blade, 1/2 inch (12.7 mm) Arbor x 0.012 inch thick

Application/ Description	Price	Cat. No.
Brittle materials (microelectronics, friable ceramics, minerals) Low concentration/fine grit diamond	$165.00	WB-0040LC
Hard tougher ceramics (silicon nitride, zirconia) Low concentration/ medium grit diamond	$165.00	WB-0045LC
Most metal samples High concentration/ medium grit diamond	$165.00	WB-0045HC

5-inch Diameter (127 mm) Wafering Blade, 1/2 inch (12.7 mm) Arbor x 0.015 inch thick

Application/ Description	Price	Cat. No.
Brittle materials (microelectronics, friable ceramics, minerals) Low concentration/ fine grit diamond	$195.00	WB-0050LC
Hard tougher ceramics (silicon nitride, zirconia) Low concentration/ medium grit diamond	$195.00	WB-0055LC
Most metal samples High concentration/ medium grit diamond	$195.00	WB-0055HC

6-inch Diameter (153 mm) Wafering Blade, 1/2 inch (12.7 mm) Arbor x 0.018 inch thick

Application/ Description	Price	Cat. No.
Brittle materials (microelectronics, friable ceramics, minerals) Low concentration/ medium grit diamond	$275.00	WB-0060LC
Hard tougher ceramics (silicon nitride, zirconia) Low concentration/ medium grit diamond	$275.00	WB-0065LC
Most metal samples High concentration/ medium grit diamond	$275.00	WB-0065HC

7-inch Diameter (178 mm) Wafering Blade, 1/2 inch (12.7 mm) Arbor x 0.020 inch thick

Application/ Description	Price	Cat. No.
Brittle materials (microelectronics, friable ceramics, minerals) Low concentration/ medium grit diamond	$325.00	WB-0070LC
Hard tougher ceramics (silicon nitride, zirconia) Low concentration/ medium grit diamond	$325.00	WB-0075LC
Most metal samples High concentration/ medium grit diamond	$325.00	WB-0075HC

CBN Wafering Blade, 1/2 inch (12.7 mm) Arbor

Application/ Description	Price	Cat. No.
4-inch CBN Wafering Blade (medium-grit, high concentration)	$165.00	WCBN-0045
5-inch CBN Wafering Blade (medium-grit, high concentration)	$195.00	WCBN-0055
6-inch CBN Wafering Blade (medium-grit, high concentration)	$275.00	WCBN-0065

7-inch MAXCUT ABRASIVE BLADES, 12.5 mm (0.5") Arbor, 10 per package

Application	Quantity	Price	Cat. No.
General abrasive blade (7-inch with 1/2-inch arbor)		$125.00	MAX-7000S
General abrasive blade (7-inch with 1.25-inch arbor)		$125.00	MAX-7000S

Diamond Wafer Cutting Fluids

Application	Price	Cat. No.
Water-based wafer cutting fluid (16 oz)	$9.50	WL-3000-16
Water-based wafer cutting fluid (32 oz)	$18.00	WL-3000-32
Oil-based wafer cutting fluid (16 oz)	$9.50	OL-3000-16
Oil-based wafer cutting fluid (32 oz)	$18.00	OL-3000-32

Miscellaneous

Description	Quantity	Price	Cat. No.
Wafering blade dressing stricks (medium grit) (1/pkg)		$7.50	DRES-0050
Porometric mounting pads (24/pkg)		$10.00	PAD-0010

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