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Alumino-silicate Glass Ceramic Specimen Preparation
(Class 11 Procedures)

Metallographic Class 11 sample preparation


Glass ceramics are unique materials that have very samll crystalline structures. The primary advantage of glass ceramics is that they produce very interesting thermochemical properties because they are impervious to thermal shock.

Proper microstructural preparation of these materials requires minimizing damage during cutting or sectioning. Therefore, the most important step in the preparation of glass ceramics is sectioning. If the glass ceramic is chipped or excessively cracked during sectioning, it may be impossible to remove this damage. Wafer sectioning with a fine grit diamond wafering blade is essential.

Planar grinding is accomplished with diamond on a metal mesh cloth to minimize cracking and subsurface damage. For rough polishing, the use of a low-napped polishing pad with polycrystalline diamond and colloidal silica eliminates most of the surface and subsurface damage. Final polishing is accomplished with a resilient porous urethane polishing pad such as BLACKCHEM 2 using SIAMAT colloidal silica.

SECTIONING

Diamond Wafering blade - fine grit / low concentration

MOUNTING

Castable Mounting with Epoxy or Acrylic resins

POLISHING

Abrasive/surface

Lubricant

Force/ sample

Speed
(Head/base)

Time

Individual
Force mode

Central Force
mode

70 micron diamond grinding disk*

Water

5-10 lbs

200/200 rpm

Until plane

 
30 um DIAMAT diamond suspension on CERMESH Metal Mesh cloth   5-10 lbs

200/200 rpm

5 minutes Metallographic individual polishing force
6 um DIAMAT diamond on TEXPAN polishing pad SIAMAT colloidal silica 10 lbs

200/200 rpm

5 minutes Metallographic individual polishing force

1 um DIAMAT diamond on GOLDPAD or ATLANTIS polishing pad

SIAMAT colloidal silica

10 lbs

200/200 rpm

5 minutes

Metallographic individual polishing force

SIAMAT Colloidal silca on TEXPAN polishing pad

 

10 lbs

100/100 rpm

5 minutes

Metallographic individual polishing force
*Required for central polishing force. Click here for more information on central vs. individual polishing force polishing.

Metallographic cutting with fine grit diamond wafering blade   Metallographic diamond cutting with incorrect wafering blade

Figure 1. Fine grit diamond cut of glass

 

Figure 2. Medium grit diamond cut of glass


Metallographic micrograph of alumino-silicate glass ceramic

Alumino-silicate glass ceramic, 400X (Polarized light) as polished

ETCHING

Common Etchants
PACE Technologies Recommended Etchants

PACE Technologies Etchant Database

CAUTION:Safety is very important when etching. Be sure to wear the appropriate protective clothing and observe all WARNINGS on chemical manufacuters SDS (Safety Data Sheets). Also review the COMMENTS and CONDITIONS Section for each etchant.


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email: pace@metallographic.com
www.metallographic.com


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