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Solder Joints on Ceramic Substrates Specimen Preparation
(Class 4 Procedures)

Metallographic Class 4 sample preparation


The microstructural preparation of electronic packages presents some very difficult challenges, such as abrasives embedding in very soft solder joints, edge rounding, polishing relief between very hard (ceramic) or brittle (silicon) materials and the very soft plastic and metal solders. The use of alumina lapping films are very useful for maintaining flatness and for minimizing fractured abrasive embedding for non-ceramic substrates. For specimens with ceramic substrates, diamond lapping films are recommended.

SECTIONING

Diamond Wafering blade - medium grit / low concentration)

MOUNTING

Castable Mounting with Epoxy or Acrylic resins

POLISHING

Abrasive/surface

Lubricant

Force/ sample

Speed
(Head/base)

Time

Individual
Force mode

Central Force
mode

30 um Diamond Lapping Film* POLYLUBE Diamond Extender 5-10 lbs

200/200 rpm

Until plane

 
15 um Diamond Lapping Film POLYLUBE Diamond Extender 5-10 lbs

200/200 rpm

3 minutes Metallographic individual polishing force
9 um Diamond Lapping Film POLYLUBE Diamond Extender 5-10 lbs

200/200 rpm

2 minutes Metallographic individual polishing force
6 um Diamond Lapping Film POLYLUBE Diamond Extender 5-10 lbs

200/200 rpm

2 minutes Metallographic individual polishing force
3 um Diamond Lapping Film POLYLUBE Diamond Extender

5-10 lbs

200/200 rpm

2 minutes

Metallographic individual polishing force

1 um DIAMAT Diamond on Atlantis polishing pad

DIALUBE Purple Lubricant

5-10 lbs

200/200 rpm

1 minute

Metallographic individual polishing force

Colloidal silica on MICROPAD or MICROPAD 2 polishing pad

 

5 lbs

200/200 rpm

30 seconds

Metallographic individual polishing force

*Required for central polishing force. Click here for more information on central vs. individual polishing force polishing.

Electronic die on a ceramic substrate microsctructure

Electronic die cross section (compliments of Analog Devices).

Electronic die cross section microstructure

Electronic die cross section (compliments of Analog Devices).

ETCHING

Common Etchants
PACE Technologies Recommended Etchants

PACE Technologies Etchant Database

CAUTION:Safety is very important when etching. Be sure to wear the appropriate protective clothing and observe all WARNINGS on chemical manufacuters SDS (Safety Data Sheets). Also review the COMMENTS and CONDITIONS Section for each etchant.


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email: pace@metallographic.com
www.metallographic.com


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Metallographic
Consumables

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Abrasive Blades
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