AlON is a dual phase material consisting of aluminum oxide and aluminum nitride phases. Proper microstructural preparation requires minimizing the relief that can occur in the aluminum nitride phase. Note some relief is helpful in microscopically mapping the aluminum nitride phase. Proper grinding is accomplished with as small a diamond abrasive as possible on a metal mesh cloth. Note there is a trade-off between planar grinding time (abrasive size) and induced damage. In some cases for ceramics, it is better to take more time and minimize damage at planar grinding in order to reduce overall polishing times. The use of SIAMAT colloidal silica also provides a chemical mechanical polishing (CMP) action which is the most effective means for eliminating both surface and subsurface damage. The combination of SIAMAT colloidal silica with DIAMAT polycrystalline diamond also produces the required surfaces finishes.
SECTIONING
Diamond Wafering blade - medium grit / low concentration
MOUNTING
Castable Mounting with Epoxy or Acrylic resins
POLISHING
Abrasive/surface |
Lubricant |
Force/ sample |
Time |
| 30 um DIAMAT diamond suspension on CERMESH Metal Mesh cloth | 5 lbs | Until plane | |
| 6 um DIAMAT diamond on TEXPAN pad | SIAMAT colloidal silica | 10 lbs | 5 minutes |
1 um DIAMAT diamond on DACRON pad |
SIAMAT colloidal silica |
10 lbs |
5 minutes |
SIAMAT Colloidal silca on TEXPAN pad |
|
10 lbs |
5 minutes |
 |
AlON ceramic, B.F. 1000x (as polished) |
 |
AlON ceramic,D.F. 1000x (as polished) |