Microstructural analysis of BaTiO3 ceramic capacitor includes looking for void and missing metal layers, as well as for gaps and voids in the ceramic substrate. Microstructural preparation of mulit-layer BaTiO3 ceramic capacitors requires minimizing polishing relief between the metal layers, coating or substrate voids, and the ceramic substrate. This is accomplished by filling the apparent voids during mounting by pouring the castable resin under vacuum and then curing under pressure. Initial grinding with 320 grit SiC paper is required to open up the capacitor, as well as to minimize microstructure damage. Rough and final polishing are recommended on low nap polishing pads using diamond and colloidal silica, respectively.
SECTIONING
Not required
MOUNTING
Castable mounting acrylics or epoxies
POLISHING
Abrasive/surface |
Lubricant |
Force/ sample |
Time |
320 grit SiC paper |
Water |
5 lbs |
Until plane |
15 um DIAMAT diamond on DACRON pad |
DIALUBE Purple Extender |
5 lbs |
3 minutes |
6 um DIAMAT diamond on DACRON pad |
DIALUBE Purple Extender |
5 lbs |
3 minutes |
1 um DIAMAT diamond on DACRON pad |
SIAMAT colloidal silica |
5 lbs |
2 minutes |
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BaTiO3 Multi-layer Ceramic Capacitor |
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BaTiO3 Multi-layer Ceramic Capacitor with void in metal layer |