PZT, or piezoelectric, devices are very useful because they generate a voltage when mechanically deformed or vice versa.
PZT’s are typically composed of lead, zirconium and titanate, which are processed at extremely high temperatures. PZT devices present the same challenges as polishing other brittle materials; however, they present the additional challenge of preparing other materials with significantly different properties (packaging materials, solders, coating, etc.). Specimen preparation must eliminate the preparation induced artifacts, as well as maintain the planarity of the specimen.
SECTIONING
Diamond wafering blade - medium grit/low concentration (if required)
MOUNTING
Castable epoxy or acrylic resins
POLISHING
Abrasive/surface |
Lubricant |
Force/ sample |
Speed |
Time |
1200 grit SiC gridning paper |
Water |
5-10 lbs |
100/100 rpm |
Until plane |
1 um DIAMAT diamond on GOLDPAD polishing pad |
|
5-10 lbs |
100/100 rpm |
3-5 minutes |
0.05 micron Nanometer Alumina on BLACKCHEM 2 polishing pad |
|
5-10 lbs |
100/100 rpm |
3-5 minutes |
SIAMAT colloidal silica on a BLACKCHEM 2 polishing pad |
|
5-10 lbs |
100/100 rpm |
1 minute |
 |
PZT cross section with sputter coating, 200,000X, as polished |
 |
| Undesirable void in PZT, 31,000X, as polished |
