SIALON ceramics is a machineable ceramic and is thus fairly easy to prepare for microstructural evaluation. The primary concern is to minimize excessive cracking during cutting and initial grinding through the use of the appropriate diamond wafering blade and with semi-fixed abrasives on a metal mesh cloth. Polishing with CMP (chemical mechanical polishing) techniques is also a very effective way to remove surface and subsurface damage to the specimen.
SECTIONING
Diamond Wafering blade - medium grit / low concentration
MOUNTING
Castable Mounting with Epoxy or Acrylic resins
POLISHING
Abrasive/surface |
Lubricant |
Force/ sample |
Speed |
Time |
| 30 um DIAMAT diamond suspension on CERMESH Metal Mesh cloth | 5-10 lbs | 200/200 rpm |
Until plane | |
| 6 um DIAMAT diamond on TEXPAN polishing pad | SIAMAT colloidal silica | 10 lbs | 200/200 rpm |
5 minutes |
1 um DIAMAT diamond on GOLDPAD polishing pad |
SIAMAT colloidal silica |
10 lbs |
200/200 rpm |
5 minutes |
SIAMAT Colloidal silca on TEXPAN polishing pad |
|
10 lbs |
100/100 rpm |
5 minutes |
 |
SiAlON ceramic, etched in molten KOH, Mag 20,000 |