Metallographic Preparation Procedures - Ceramics

Silicon Nitride Engineering Ceramics

The key to proper specimen preparation of hard / tough ceramic materials such as silicon nitride (Si3N4) is to grind with a semi-fixed abrasive (polycrystalline diamond on a metal mesh cloth), followed by the use of CMP (chemical mechanical polishing) techniques using colloidal silica.

SECTIONING

Diamond Wafering blade - medium grit / low concentration

MOUNTING
Castable Mounting with Epoxy or Acrylic resins

POLISHING

Abrasive/surface

Lubricant

Force/ sample

Time

30 um DIAMAT diamond suspension on CERMESH Metal Mesh cloth   5 lbs Until plane
6 um DIAMAT diamond on TEXPAN pad SIAMAT colloidal silica 10 lbs 5 minutes

1 um DIAMAT diamond on DACRON pad

SIAMAT colloidal silica

10 lbs

5 minutes

SIAMAT Colloidal silca on TEXPAN pad

 

10 lbs

5 minutes


Metallographic micrograph of silicon nitride ceramics

Silicon Nitride polished with CMP techniques
400X (DIC) as polished

Silicon Nitride polished by conventional 9,6,3,1,0.25 um diamond steps. Note that the damage is not removed even after long polishing times. 400X (DIC) as polished

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