Specimen preparation of friable or brittle materials such as silicon offer a microstructural preparation challenge. Proper microstructural preparation of these materials must minimize fracturing the silicon structure. This is accomplished by first by cutting or sectioning with fine grit / low concentration diamond blades. Oftentimes microelectronic cross sections are not encapsulated and just mounted using a hot melt tape. If the specimens are encapsulated, a castable mounting compound such as an acrylic or an epoxy is recommended. Initial grinding and polishing with diamond lapping films is required to prevent undue damage to the silicon during grinding. Rough polishing is accomplished on low napped polishing cloths using diamond, with final polishing for a very short time on a high napped cloth using collodial silica.
SECTIONING
Diamond Wafering blade - fine grit / low concentration
MOUNTING
Hot melt tape or castable mounting with Epoxy or Acrylic resins
POLISHING
Abrasive/surface |
Lubricant |
Force/ sample |
Time |
| 15 um Diamond Lapping Film | POLYLUBE Diamond Extender | 5 lbs | 3 minutes |
| 9 um Diamond Lapping Film | POLYLUBE Diamond Extender | 5 lbs | 2 minutes |
| 6 um Diamond Lapping Film | POLYLUBE Diamond Extender | 5 lbs | 2 minutes |
| 3 um Diamond Lapping Film | POLYLUBE Diamond Extender | 5 lbs | 2 minutes |
1 um DIAMAT Diamond on DACRON pad |
DIALUBE Purple Lubricant |
5 lbs |
1 minute |
| Colloidal silica on MICROPAD polishing pad | 5 lbs | 30 seconds |
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Figure 1. Fine grit diamond cut |
Figure 2. Medium grit diamond |