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Slag Specimen Preparation

Metallographic etchant database

Proper microstructural preparation of slags requires proper cutting or sectioning with a fine grit diamond blade (Figure 1 and 2). If the slag (glass) is chipped or excessively cracked during sectioning it may be impossible to remove the damage.

Planar grinding is best accomplished with a semi-fixed diamond on a metal mesh cloth. Intermediate grinding and polishing is accomplished by combining the mechanical component of diamond abrasives with the chemical polishing effect of colloidal silica. Final polishing on a resilient polishing pad such as BLACK CHEM using SIAMAT colloidal silica produces a damage free surface ready for examination (Figure 3).


Diamond Wafering blade - fine grit / low concentration

Castable Mounting with Epoxy or Acrylic resins




Force/ sample



30 um DIAMAT diamond suspension on CERMESH Metal Mesh cloth   5-10 lbs

200/200 rpm

Until plane
6 um DIAMAT diamond on TEXPAN polishing pad SIAMAT colloidal silica 10 lbs

200/200 rpm

5 minutes

1 um DIAMAT diamond on GOLDPAD polishing pad

SIAMAT colloidal silica

10 lbs

200/200 rpm

5 minutes

SIAMAT Colloidal silca on TEXPAN polishing pad


10 lbs

100/100 rpm

5 minutes

Metallographic cutting with fine grit diamond wafering blade   Metallographic diamond cutting with incorrect wafering blade

Figure 1. Fine grit diamond cut of glass

  Figure 2. Medium grit diamond cut of glass

Metallographic micrograph of slag

Slag, 100X (Polarized light), as polished condition

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