Copper and copper alloys are difficult to prepare because they have a tendency to work harden and have oxide inclusions. The result is that the oxide inclusions can become dislodged and scratch the surface. This scratching is more apparent following etching.
To minimize oxide inclusion pull-out, preparation damage can be minimized by using fine grit SiC paper and polishing with colloidal silica and diamond for the intermediate polishing step, followed by polishing with a fine seeded jell nanometer alumina.
SECTIONING
MAXCUT Abrasive blade (Cat. No. MAX-E series)
MOUNTING
Compression Mounting with Phenolic, Epoxy or Diallyl Phthalate compression mounting resins
POLISHING
Abrasive/surface |
Lubricant |
Force/ sample |
Time |
320 grit SiC paper |
Water |
5 lbs |
Until plane |
1 um DIAMAT diamond on DACRON pad |
DIALUBE Purple Extender |
5 lbs |
2 minutes |
0.05 um Nanometer alumina on NAPPAD pad |
|
5 lbs |
30 seconds |
 |
Tough Pitch Copper, B.F. 100X, Etchant NH4OH / H2O2 |