The key to proper specimen preparation of hard / tough CERMET materials such as tungsten carbide is to to grind with a semi-fixed abrasive (polycrystalline diamond on a metal mesh cloth), followed by combining diamond abrasive with a CMP (chemical mechanical polishing) abrasive such as SIAMAT colloidal silica.
SECTIONING
Diamond Wafering blade - medium grit / low concentration
MOUNTING
Castable Mounting with Epoxy or Acrylic resins
POLISHING
Abrasive/surface |
Lubricant |
Force/ sample |
Speed |
Time |
| 30 um DIAMAT diamond suspension on CERMESH Metal Mesh cloth | DIALUBE Diamond Extender | 5-10 lbs | 200/200 rpm |
Until plane |
| 9 um DIAMAT diamond on POLYPAD polishing pad | DIALUBE Diamond Extender | 5-10 lbs | 200/200 rpm |
3 minutes |
| 3 um DIAMAT diamond on TEXPAN polishing pad | DIALUBE Diamond Extender | 5-10 lbs | 200/200 rpm |
3 minutes |
1 um DIAMAT diamond on ATLANTIS polishing pad |
SIAMAT colloidal silica |
5-10 lbs |
200/200 rpm |
3 minutes |
 |
Tungsten carbide, 1500X (DIC), etched with 50% HNO3 and 50% HCl |