Preparation of tungsten can produce a surface deformation layer during rough polishing. This layer can be removed by light etching the surface with Murakami's reagent prior to final polishing.
SECTIONING
MAXCUT Abrasive blade (Cat. No. MAX-I series)
MOUNTING
Compression Mounting with Phenolic, Epoxy or Diallyl Phthalate compression mounting resins
POLISHING
Abrasive/surface |
Lubricant |
Force/ sample |
Speed |
Time |
P220 grit ALO paper |
Water |
5-10 lbs |
100/100 rpm |
Until plane |
1 micron DIAMAT diamond on ATLANTIS polishing pad |
DIALUBE Purple Extender |
5-10 lbs |
100/100 rpm |
1 minute |
0.05 um acidic Nanometer acid alumina on a BLACKCHEM 2 pad |
Polishing with 10% Diluted etchant below: Tungsten - |
5-10 lbs |
100/100 rpm |
1 minute |
 |
Tungsten refractory metal, 200X (DIC), etched with Murakami's reagent. |