Preparation of tungsten can produce a surface deformation layer during rough polishing. This layer can be removed by light etching the surface with Murakami's reagent prior to final polishing.
SECTIONING
MAXCUT Abrasive blade (Cat. No. MAX-H series)
MOUNTING
Compression Mounting with Phenolic, Epoxy or Diallyl Phthalate compression mounting resins
POLISHING
Abrasive/surface |
Lubricant |
Force/ sample |
Time |
| 120 grit SiC paper 240 grit SiC paper 400 grit SiC paper 600 grit SiC paper |
Water Water Water Water |
5 lbs 5 lbs 5 lbs 5 lbs |
Until plane 1 minute 1 minute 1 minute |
| 9 um DIAMAT diamond on POLYPAD pad | DIALUBE Diamond Extender | 5 lbs | 3 minutes |
| 3 um DIAMAT diamond on DACRON pad | DIALUBE Diamond Extender | 5 lbs | 3 minutes |
1 um DIAMAT diamond on DACRON pad |
DIALUBE Diamond Extender |
5 lbs |
3 minutes |
0.05 um NANOMETER Alumina on MICROPAD pad |
Etch polish |
5 lbs |
1 minutes |
 |
Tungsten refractory metal, 200X (DIC), etched with Murakami's reagent. |