Metallographic Preparation Procedures - Refractory

Tungsten Refractory

Preparation of tungsten can produce a surface deformation layer during rough polishing. This layer can be removed by light etching the surface with Murakami's reagent prior to final polishing.

SECTIONING
MAXCUT Abrasive blade (Cat. No. MAX-H series)

MOUNTING
Compression Mounting with Phenolic, Epoxy or Diallyl Phthalate compression mounting resins

POLISHING

Abrasive/surface

Lubricant

Force/ sample

Time

120 grit SiC paper
240 grit SiC paper
400 grit SiC paper
600 grit SiC paper
Water
Water
Water
Water
5 lbs
5 lbs
5 lbs
5 lbs
Until plane
1 minute
1 minute
1 minute
9 um DIAMAT diamond on POLYPAD pad DIALUBE Diamond Extender 5 lbs 3 minutes
3 um DIAMAT diamond on DACRON pad DIALUBE Diamond Extender 5 lbs 3 minutes

1 um DIAMAT diamond on DACRON pad

DIALUBE Diamond Extender

5 lbs

3 minutes

0.05 um NANOMETER Alumina on MICROPAD pad

Etch polish

5 lbs

1 minutes


Metallographic micrograph of tungsten refractory

Tungsten refractory metal, 200X (DIC), etched with Murakami's reagent.

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