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Metallographic Preparation Procedures - Refractory

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Tungsten Refractory

Preparation of tungsten can produce a surface deformation layer during rough polishing. This layer can be removed by light etching the surface with Murakami's reagent prior to final polishing.

SECTIONING
MAXCUT Abrasive blade (Cat. No. MAX-I series)

MOUNTING
Compression Mounting with Phenolic, Epoxy or Diallyl Phthalate compression mounting resins

POLISHING

Abrasive/surface

Lubricant

Force/ sample

Time

30 micron alumina film paper
15 micron alumina film paper
9 micron alumina film paper
5 micron alumina film paper
3 micron alumina film paper

Water and etchant
Water and etchant
Water and etchant
Water and etchant
Water and etchant

5 lbs
5 lbs
5 lbs
5 lbs
5 lbs

Until plane
1 minute
1 minute
1 minute
1 minute

1 um DIAMAT diamond on ATLANTIS polishing pad

DIALUBE Purple Extender

5 lbs

1 minute

0.05 um acidic Nanometer acid alumina on a BLACKCHEM 2 pad

Polishing with 10% Diluted etchant below:

Tungsten - 15 ml HNO3, 3 ml HF, 80 ml water

5 lbs

30 seconds



Metallographic micrograph of tungsten refractory

Tungsten refractory metal, 200X (DIC), etched with Murakami's reagent.

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