Preparation of tungsten can produce a surface deformation layer during rough polishing. This layer can be removed by light etching the surface with Murakami's reagent prior to final polishing.
SECTIONING
MAXCUT Abrasive blade (Cat. No. MAX-I series)
MOUNTING
Compression Mounting with Phenolic, Epoxy or Diallyl Phthalate compression mounting resins
POLISHING
Abrasive/surface |
Lubricant |
Force/ sample |
Time |
30 micron alumina film paper |
Water and etchant |
5 lbs |
Until plane |
| 1 um DIAMAT diamond on ATLANTIS polishing pad | DIALUBE Purple Extender |
5 lbs |
1 minute |
0.05 um acidic Nanometer acid alumina on a BLACKCHEM 2 pad |
Polishing with 10% Diluted etchant below: Tungsten - 15 ml HNO3, 3 ml HF, 80 ml water |
5 lbs |
30 seconds |
 |
Tungsten refractory metal, 200X (DIC), etched with Murakami's reagent. |