Microelectromechanical systems (MEMS) devices are also referred to as micromachines. MEMS devices are made up of components varying in size between 1 micron to 0.1 mm.
Microstructural cross section preparation of MEMS devices presents the same challenges as polishing other specimens having material properties ranging from very hard and brittle (silicon, ceramics, etc.) to soft and ductile (soft metals, metallized layers, sputter coating, etc.). Specimen preparation must eliminate any preparation induced artifacts, as well as maintain the planarity of the specimen.
SECTIONING
Diamond wafering blade - medium grit/low concentration (if required)
MOUNTING
Castable epoxy or acrylic resins
POLISHING
Abrasive/surface |
Lubricant |
Force/ sample |
Speed |
Time |
600 grit SiC gridning paper |
Water |
5-10 lbs |
100/100 rpm |
Until plane |
1 um DIAMAT diamond on TEXPAN polishing pad |
SIAMAT colloidal silica |
5-10 lbs |
100/100 rpm |
3-5 minutes |
SIAMAT colloidal silica on a BLACKCHEM 2 polishing pad |
|
5-10 lbs |
100/100 rpm |
3-5 minutes |
 |
Aluminum-silicon substrate MEMS device with a gold bond on a nickel intermediate layer, Mag. 200X, as polished |
 |
| Wire bond for MEMS device, 200X, as polished |
