Browse our complete line of metallographic equipment, organized by preparation step.
Sectioning
Precision cutting equipment for clean, damage-free sample sectioning. Choose from precision wafering systems for delicate materials or abrasive cutters for faster throughput. Minimizes deformation and heat-affected zones for accurate analysis.
Mounting
Compression and castable mounting systems with a complete range of mounting materials. Protect delicate features and ensure proper edge retention for analysis. Provides excellent edge preservation and sample protection during preparation.
Grinding & Polishing
Progressive material removal with PENTA hand and belt grinders, plus NANO-FEMTO grinder-polishers. Remove sectioning damage and achieve flat surfaces with controlled scratch patterns. Precise control over material removal rates and surface finish quality.
Vibratory Polishing
GIGA vibratory polishers provide gentle, uniform surface finishing for delicate specimens. Ideal for EBSD preparation and applications requiring minimal deformation. Eliminates directional scratches and produces mirror-like finishes essential for advanced characterization.
Analysis Equipment
Hardness testers and microscopes for comprehensive material analysis. Digital displays and automated processes support both research and production applications. Enables quantitative hardness measurements and high-resolution microstructural examination.
Lab Furniture
Durable, high-performance furniture designed to support precision work and safety. From ventilated fume hoods and storage cabinets to ergonomic workbenches and microscope stations. Creates organized, efficient workspaces that enhance productivity and safety.
Frequently Asked Questions
What equipment is needed for metallographic sample preparation?
A complete metallographic sample preparation workflow requires sectioning equipment (abrasive cutters or precision saws), mounting systems (compression or castable), grinding and polishing machines, and analysis equipment (hardness testers and microscopes). PACE Technologies offers equipment for each stage of the process.
What is the difference between abrasive sectioning and precision wafering?
Abrasive sectioning uses abrasive wheels for faster cutting of most materials, while precision wafering uses diamond blades for delicate materials requiring minimal damage and heat-affected zones. Choose abrasive sectioning for general applications and precision wafering for sensitive materials like electronics or brittle ceramics.
Do I need both compression and castable mounting systems?
Compression mounting is ideal for most standard applications and provides excellent edge retention. Castable mounting (vacuum, pressure, or UV) is better for delicate or heat-sensitive samples. Many labs use both systems depending on sample requirements.