PACE Technologies offers two types of magnetic polishing pad systems for economical, convenience and time savings for rapid changing and storage of the polishing cloths. Both systems require a magnetic base pad (MAGNETRON base), which is permanantly attached to the working wheel with a pressure sensitive adhesive. For the first system PSA backed polishing cloths can be temporarily attached to a telfon coated magnetic metal plate. This plate with the attached polishing pad can be easily removed and exchanged. When the polishing pad has been depleated, simply remove the polishing pad from the teflon coated plate and replace with a new PSA backed polishing pad.
For our newest magnetic system a flexible magnetic has already been attached to the polishing pad. Simply position the polishing pad on the working plate which has the MAGNETON base and you are ready to go to work. To remove just pull up and remove the mangetic polishing pad.
Magnetic system for PSA backed Polishing Pads
Magnetic system for magnetic backed Polishing Pads
CERMESH Metal Mesh cloth - this is a wire mesh material useful for coarse and intermediate lapping/polishing. The texture of this wire allows for the abrasive to become semi-fixed; thus offering the advantage of increased stock removal, while minimizing damage
POLYPAD Polishing Pad - this cloth is a synthetic polyester polishing pad which has a similar action to a nylon pad, with the exception that it is much more durable. It is used in the intermediate polishing steps
TEXPAN Polishing Pad - this is the most commonly used polishing cloth material for the intermediate polishing steps. TEXPAN Polishing pad is a non-woven polishing pad.
Black CHEM 2 Polishing Pad this is a porometric polymer pad which has a consistency similar to a rubber type of pad. Black CHEM 2 pad has a low nap but behaves as an intemediate polishing pad with a performance between low napped and high napped pads.
DACRON II Polishing Cloth - this is a low napped polishing pad for polishing primarily with 1-15 micron diamond abrasives. The DACRON II pad is the most popular intermediate polishing pad in Europe and is used mostly for polishing metals. Its high nap provides it a very soft and gentle polishing action.
Note: DACRON is a registered trade name of DUPONT Corporation.
NYPAD Polishing Pad - this is a low napped silk polishing pad for intermediate polishing primarily with intermediate diamond abrasives.
GOLD PAD Polishing Pad is a low napped polishing pad for imtermediate polishing primarily with 1-9 micron diamond.
ATLANTIS Polishing Pad - is a woven low napped final with a foam backing for better matting to the specimen sample. It is an excellent polishing pad for 1-6 micron diamond.
MICROPAD Polishing Cloth- this is the most common high napped final polishing pad for most metals and polymers. Its high nap provides it a very soft and gentle polishing action.
TRICOTE Polishing Pad- a tight high napped final polishing pad for most metals. It has a tigher nap then the MCIROPAD Polishing Pads
NAPPAD Polishing Pad- this is another high napped final polishing pad useful for most metals and polymers. It has a higher nap than MICROPAD, providing it with a very gentle polishing action which is very useful for polishing soft materials such as copper, aluminun and austentite steels.
MOLTEC 2 Polishing Pad - this is wool polishing cloth used for final polishing and has a very high nap. It is most commonly used for final polishing metals where edge retention is a minimal consideration.
FELT PAD Polishing Pad - this is thick felt pad used for final polishing glass and large surface area parts.
Polishing can be broken into two stages: rough and final polishing. Proper rough polishing removes all subsurface damage produced during cutting and grinding. In most cases this is accomplished with polycrystalline diamond abrasives and low napped polishing cloths. The final polishing step should be kept to a minimum and used only to clean up surface blemishes. Note that excessive final polishing times can result in phase relief, edge rounding, smeared material and inclusion pull-out. Final polishing is accomplished with high napped cloths and fine graded alumina or colloidal silica abrasives.
Minimizing Polishing Artifacts
To minimize polishing artifacts such as edge rounding, phase relief, smeared metal, grain pull-out and inclusion pull-out, the polishing time needs to be kept to a minimum. This can be accomplished by:
minimizing sectioning damage
grinding with the finest feasible abrasives
using flat polishing base plates
Minimizing sectioning damage and using the correct grinding abrasives are fairly obvious. However, using a flat supporting plate is generally over looked by most suppliers of metallographic equipment, and if they do consider plate flatness they generally do not go far enough. As a guideline, an 8-inch plate should have no more than a 0.0001 inch (2.5 um) runout, which represents a 0.6 um runout over a 1-inch diameter specimen. Recognize that final polishing abrasives have a typical size of 0.05-0.06 um, thus these tolerances are required to minimize polishing times. In addition, if the specimen is not flat on the polishing plate then a differential pressure occurs across the specimen, which causes polishing relief. Likewise for a 12-inch diameter plate the runout should not exceed 0.0002 inches (5 um). As a result both polishing times and differential polishing pressures can be minimized.
Suggestion: If your polishing plate is not flat within these tolerances they should be lapped to these tighter tolerances.