Magnetic Polishing System

Introduction

The magnetic polishing system simplifies pad transitions by using magnetic-backed pads and disks with magnetic baseplates. This eliminates adhesive cleanup and enables quick changes between polishing stages.

Magnetic-backed pads offer the same pad selection as PSA-backed pads, with the added benefit of instant removal and repositioning. The system maintains consistent flatness and contact uniformity, making it ideal for high-throughput applications.

All standard polishing pads are available with magnetic backing, from coarse CERMESH to final polishing pads like MICROPAD and NAPPAD. The selection criteria remain the same: choose based on polishing stage and material requirements.

Magnetic Pad Selection Guideline

Magnetic-backed pads offer the same selection as PSA pads. Choose based on polishing stage and material requirements:

Pad Image & Link	Use Case	Pad Icon	Polishing Stage
	CERMESH metal mesh pad used for semi-fixed abrasive coarse to intermediate lapping. Excellent for initial removal of damage from sectioning and hard materials.		Coarse / Intermediate
	POLYPAD is a durable synthetic polyester pad ideal for intermediate polishing, especially with 6-15 µm diamond abrasives. Designed as a long-life nylon alternative.		Intermediate
	TEXPAN is a widely used non-woven intermediate polishing pad, compatible with most diamond suspensions. Effective across a broad range of materials.		Intermediate
	Black CHEM 2 is a porometric polymer pad with rubber-like consistency, offering balanced action between low and high nap pads. Ideal for moderate nap intermediate polishing.		Intermediate
	DACRON II is a low-napped soft polishing pad widely used in Europe for intermediate steps on metals. Suitable for 1-15 µm diamond abrasives.		Intermediate
	NYPAD is a low-napped silk pad tailored for intermediate polishing of harder metals and alloys. Performs well with mid-size diamond abrasives.		Intermediate
	GOLD PAD is a low-napped pad ideal for 1-9 µm polishing. Designed for consistent material removal and flatness control during final pre-polishing.		Intermediate
	ATLANTIS is a woven low-nap final polishing pad with foam backing for enhanced compliance. Ideal for 1-6 µm diamond. Great for critical surface flatness needs.		Final
	MICROPAD is a high-napped final polishing pad ideal for producing a mirror finish on metals and polymers. Recommended for <1 µm diamond or colloidal silica.		Final
	TRICOTE is a tight high-napped final polishing pad for metals. Offers better control of surface texture and minimal abrasive drag.		Final
	NAPPAD is a very high-napped final polishing pad tailored for soft metals and polymers. Provides gentle polishing action to minimize pull-out and relief.		Final
	MOLTEC 2 is a wool-based final polishing cloth used when edge retention is not critical. Works well with alumina and colloidal silica on metals.		Final
	FELT PAD is a thick final polishing pad made for large samples or glass. Ideal for use with colloidal silica or alumina slurries where surface uniformity is key.		Final

Process Description

Polishing involves two stages: rough and final. Rough polishing removes deformation from grinding using low-napped pads and polycrystalline diamond abrasives. Final polishing uses high-napped cloths and finer abrasives (alumina or colloidal silica) to eliminate minor defects.

Using magnetic-backed pads simplifies transitions between stages and ensures consistent flatness due to firm, uniform adhesion across the platen. This stability minimizes polishing artifacts and helps maintain process control across multiple specimens.

Minimize polishing time to prevent artifacts like relief, edge rounding, and smear. Excessive polishing can compromise microstructural accuracy. For detailed polishing techniques, see our Polishing Methods Guide.

Minimizing Polishing Artifacts

• Minimize sectioning and grinding damage upfront
• Use the finest effective abrasive at each stage
• Ensure polishing plates are flat (≤2.5 µm runout for 8" plates)
• Use magnetic systems to maintain stable, reusable pad alignment

A flat plate prevents uneven pressure that leads to polishing relief. When using magnetic baseplates, ensure proper cleaning between pad swaps to preserve flat contact and long-term performance.

Recommended Procedures

• Place magnetic-backed pad on a clean magnetic baseplate
• Pre-charge pad with abrasive suspension, paste, or powder
• Apply appropriate lubricant
• Begin polishing with reduced force to avoid tearing
• Clean specimen and pad during the last 10-15 seconds
• Wipe both pad and baseplate dry before storage to avoid corrosion

Troubleshooting