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Ti-AP-16

Material Specific

Composition

Ammonium hydroxide 7–12%, Hydrogen peroxide 0.1–1%, Amorphous silica (colloidal) 30–50%

PACE product, by weight

Method

Chemo-mechanical polish (on wheel)

Time

2–5 min final polish

Alternative Names

Titanium AP-16Titanium Etchant AP-16

Tags

titaniumtitanium-alloyattack-polishchemo-mechanical-polishpolishing-slurry

Reveals

Alpha / beta phase contrast on the final-polished surface (no separate etch needed); grain boundaries; transformed beta colonies

Typical Results

Ti-AP-16 is a chemo-mechanical attack-polishing slurry, NOT an etchant. It is used on a polishing wheel as the final prep step. The alkaline NH4OH / H2O2 chemistry chemically attacks titanium while the colloidal silica (30–50%) polishes mechanically. The combined action produces an etch-ready surface with alpha / beta contrast already developed, so no separate Kroll's etch is needed for routine imaging.

Application Method

Method:Chemo-mechanical polish (on wheel)
Typical Time:2–5 min final polish

Preparation Notes

PACE Ti-AP-16 is supplied ready-to-use. Composition (by weight):

IngredientCAS No.%Hazardous
Ammonium hydroxide1336-21-67–12%Yes
Hydrogen peroxide7722-84-10.1–1%Yes
Amorphous silica (colloidal)7631-86-930–50%No
Water7732-18-540–60%No

Application Notes

Apply to a final-polish pad (microcloth, MicroFloc, or similar). Use as the FINAL step after the standard SiC + diamond progression (typically after 3 µm or 1 µm diamond). Polish 2–5 min at 100–150 RPM with light-to-moderate pressure. Rinse copiously with water during and after; silica residue must be removed completely.

Troubleshooting

Silica residue left on the sample shows up as a uniform "haze" under the microscope; finish with a water-only lap on a clean pad, or rinse longer. Inadequate contrast → polish longer or increase pad pressure. NH4OH evaporates; keep the bottle capped between uses.

Storage Notes

Per PACE SDS, cool storage; the colloidal silica may settle, so agitate before use. Discard if the solid becomes a gel (irreversible silica aggregation).

Alternative Etchants

  • Kroll's Reagent (if using a separate-etch workflow on regular polished surface)
  • Modified Kroll's Reagent

Similar Etchants

  • Colloidal silica attack-polish products (e.g., OP-S, MasterMet 2 for Ti)

ASTM References

Not applicable. Polishing consumable, not etchant. See ASTM E1558 (Electrolytic Polishing) for context.