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Basics Guide

Metallography Equipment Overview

Every metallography lab is built around the same five-stage workflow: sectioning, mounting, grinding & polishing, microscopy, and hardness testing. This guide walks the workflow stage by stage, shows the PACE Technologies equipment behind each step, and ends with a quick chooser for new and growing labs.

The Metallography Workflow

Tap any stage to jump to its equipment.

Not sure what you need? Get a personalized equipment and consumables recommendation in a few minutes.

Introduction

A metallography lab is a sequence of dependent steps: a poor cut limits what mounting can fix, a poor mount limits what grinding can fix, and so on down the line. Each stage of the workflow has its own equipment family, and within each family, the choice between manual, automated, pneumatic, hydraulic, or specialty systems comes down to sample volume, materials, and required precision.

This page walks the workflow stage by stage, showing the PACE Technologies equipment behind each step alongside the fundamentals that apply across the industry. Specific models and features vary by manufacturer; the equipment categories and their purposes do not.

📹 Video Tutorials by Dr. Donald Zipperian. The founder of PACE Technologies has recorded equipment-in-use demonstrations for every stage of the workflow:

Visit the PACE Technologies YouTube channel for more equipment demonstrations and tutorials.

Stage 1 of 5 Abrasive cutters · Precision wafering saws · 4 product families

Sectioning Equipment

Sectioning equipment is used to cut samples from larger workpieces. The type of sectioning equipment you need depends on the materials you work with, sample size requirements, and the level of precision needed.

Abrasive Cutters

Abrasive cutters use rotating abrasive wheels (typically aluminum oxide or silicon carbide) to cut through a wide range of materials and sizes. They are the most common choice for general metallographic work, faster and more cost-effective than precision wafering, though they generate more heat and may cause more deformation in soft or delicate materials.

Manual Abrasive Cutters

Operator-controlled cutting with manual feed. Suitable for low to medium volume work and when operator control over cutting speed is important.

  • Manual feed control
  • Cost-effective for smaller labs
  • Good for various material types

View Manual Cutters →

Automated Abrasive Cutters

Programmable cutting with automatic feed control. Ideal for high-volume work, consistent cutting parameters, and reduced operator fatigue.

  • Programmable cutting parameters
  • Consistent, repeatable results
  • Higher throughput

View Automated Cutters →

Precision Wafering Saws

Precision wafering saws use thin diamond or CBN blades for cutting with minimal damage and deformation (kerf widths typically 0.1–0.5 mm). Slower and more expensive than abrasive sectioning, but essential for delicate materials, small samples, electronics, ceramics, and EBSD preparation where sectioning damage must be minimized. Learn more in our Sectioning guide and browse sectioning consumables.

Gravity Feed Precision Cutters

Gravity-fed cutting mechanism provides consistent, low-damage sectioning with minimal operator intervention. The weight of the cutting head provides consistent feed pressure. Excellent for delicate materials, small samples, and when consistent cutting parameters are needed.

  • Consistent feed pressure from gravity
  • Minimal operator intervention required
  • Ideal for delicate and small samples

View Gravity Feed Cutters →

Table Feed Precision Cutters

Motorized table feed provides automated precision cutting with programmable feed rates. Offers excellent control and repeatability for high-precision applications. Ideal for production environments and when precise, repeatable cutting parameters are required.

  • Programmable feed rates
  • Excellent repeatability
  • Ideal for production and high-precision work

View Table Feed Cutters →

Stage 2 of 5 Compression presses · Castable resin systems · 5 product families

Mounting Equipment

Mounting equipment embeds samples in resin to create standardized, easy-to-handle mounts. Different mounting methods are available depending on your needs.

Compression Mounting Presses

Compression mounting uses heat (typically 150-180°C) and pressure (2000-4000 psi) to embed samples in thermosetting resins. This method is fast (typically 5-15 minutes per cycle) and produces durable, hard mounts with excellent edge retention. Ideal for high-throughput laboratories and standard metal samples. For detailed mounting techniques, see our Mounting guide and mounting consumables.

Pneumatic Mounting Presses

Air-powered compression mounting using compressed air to generate pressure. Fast cycle times and consistent pressure application. Good for medium to high volume work. Generally more cost-effective than hydraulic systems for standard applications.

  • Fast cycle times
  • Consistent pressure application
  • Cost-effective for standard applications

View Pneumatic Presses →

Hydraulic Mounting Presses

Hydraulic-powered compression mounting using hydraulic fluid to generate pressure. Higher pressure capability than pneumatic systems, making them suitable for larger samples, harder mounting materials, or when maximum pressure is required for optimal edge retention.

  • Higher pressure capability
  • Suitable for larger samples
  • Ideal for harder mounting materials

View Hydraulic Presses →

Castable Mounting Systems

Castable mounting uses room-temperature curing resins without the heat and pressure of compression mounting. Essential for heat-sensitive materials (aluminum alloys, polymers, composites), delicate samples, irregular shapes, and when mounting multiple samples simultaneously. Curing times range from 30 minutes to several hours depending on resin type. Learn more in our Mounting guide and browse mounting consumables.

Pressure Mounting

Room-temperature curing under moderate pressure (typically 30-50 psi) for faster cycles and improved resin flow. Reduces bubble formation and improves edge retention compared to atmospheric curing.

Vacuum Mounting

Removes air bubbles from the resin before and during curing, producing clear, bubble-free mounts. Essential for transparent mounting materials and when bubble-free mounts are critical.

UV Curing

Fast UV-cured mounting for rapid turnaround (typically 5-15 minutes). Uses UV light to cure specialized resins quickly. Ideal for high-throughput applications with appropriate resin systems.

Stage 3 of 5 Manual · Semi-automated · Controlled removal · Vibratory · 5 product families

Grinding & Polishing Equipment

Grinding and polishing equipment creates flat, scratch-free surfaces suitable for microscopic examination. Equipment ranges from manual systems to fully automated polishers.

Grinder-Polisher Bases

Manual systems provide operator control over the preparation process. The operator controls pressure, speed, rotation direction, and technique. Suitable for low to medium volume work, learning environments, and when flexibility to adapt techniques for different materials is important. For grinding techniques, see our Grinding Techniques guide and grinding consumables.

Grinder-Polisher Bases

Single-wheel manual systems for grinding and polishing. Operator controls pressure, speed, and technique. Cost-effective and versatile.

  • Single or dual wheel options
  • Operator-controlled preparation
  • Suitable for various materials

View Manual Polishers →

Hand & Belt Grinders

Belt grinding systems for initial material removal on large or irregular workpieces, fixturing prep, and rough flattening before mounted-sample grinding begins.

  • Fast bulk material removal
  • Robust construction for shop-floor use
  • Coolant-flow ports on PENTA Series

View Belt Grinders →

Semi-Automated Grinder Polishers

Semi-automated systems provide programmable preparation cycles with automatic head movement and force application. The operator loads samples and selects the program, but the system controls the preparation parameters. This provides a good balance between automation and flexibility, ensuring consistent results while allowing operator oversight. See preparation procedures for automated system protocols.

Semi-Automated Systems

Programmable preparation cycles with automatic head movement and force control. Operator loads samples and selects the program; the system handles pressure, time, and rotation. Consistent results with reduced operator time.

  • Programmable force and time per step
  • Repeatable across batches and operators
  • Attachment heads available for manual polisher upgrade

View Semi-Automated Systems →

Controlled Removal Polishers

Advanced systems with precise material removal control. Essential for applications requiring exact material removal rates or depth measurements, such as PCB preparation, thin film analysis, and case depth measurements.

Controlled Removal Systems

Precise material-removal control for applications where exact depth or planarity matters. Ideal for plano-parallel preparation, thin-section work, and any application where the amount removed must be measured rather than estimated.

  • Precise depth control and measurement
  • Ideal for thin sections and coatings
  • Essential for PCB and electronic-component preparation

View Controlled Removal Systems →

Vibratory Polishers

Vibratory polishing uses vibration to polish samples, eliminating subsurface damage and producing superior surface finishes. This method is particularly effective for EBSD (Electron Backscatter Diffraction) sample preparation and applications requiring minimal deformation. For detailed information, see our Polishing Methods guide and polishing consumables.

Vibratory Polishing Systems

Cost-effective alternative for final polishing that eliminates subsurface damage and produces superior flatness and planarity. Ideal for batch processing and any application requiring minimal mechanical deformation.

  • Eliminates subsurface damage
  • Superior flatness and planarity
  • Ideal for EBSD preparation
  • Batch processing capability
  • Reduces operator variability

View Vibratory Polishers →

Stage 4 of 5 Metallurgical · Stereo · Image analysis · 3 product families

Microscopy Equipment

Microscopes are essential for examining prepared samples and analyzing microstructures. The type of microscope you need depends on your analysis requirements.

Metallurgical Microscopes

Metallurgical microscopes use reflected light illumination to examine opaque samples, unlike biological microscopes that use transmitted light. They are essential for routine metallographic examination and microstructure analysis. These microscopes are designed to work with polished and etched samples, providing the magnification and illumination modes needed to reveal microstructural features. For analysis techniques, see our Microstructural Analysis guide.

Metallurgical Microscopes

Reflected light microscopes for examining prepared metallographic samples. Standard equipment for microstructure analysis.

  • Brightfield, darkfield, and DIC (Differential Interference Contrast) illumination modes
  • Magnifications typically from 50x to 1000x or higher
  • Digital imaging capabilities for documentation and analysis
  • Polarized light options for certain applications

View Metallurgical Microscopes →

Stereo Microscopes

Low-magnification 3D viewing (typically 5x to 50x) for sample inspection, fracture surface examination, and general sample observation. Essential for macroscopic examination before and after preparation, checking for defects, and orienting samples.

  • Low magnification (5x-50x typical range)
  • 3D depth perception
  • Useful for fracture analysis and sample inspection

View Stereo Microscopes →

Image Analysis Systems

Digital imaging and analysis systems for capturing, storing, and analyzing microstructures. Essential for documentation and quantitative analysis. These systems enable automated grain size measurement, phase quantification, and defect detection. See image analysis systems for available options.

Image Analysis Systems

Software and hardware for capturing, analyzing, and quantifying microstructural features: grain size, phase fraction, inclusion rating, defect counting, and other automated measurements that turn images into data.

  • Grain-size measurement (ASTM E112)
  • Phase and inclusion quantification
  • Automated reporting and traceability

View Image Analysis Systems →

Stage 5 of 5 Rockwell · Microhardness · Brinell & Vickers · 3 product families

Hardness Testing Equipment

Hardness testing equipment measures material hardness, often on prepared metallographic samples. Different test methods are available depending on requirements. For hardness testing preparation techniques, see hardness testing consumables and preparation procedures.

Rockwell Hardness Testers

Common macrohardness testing method using indentation depth measurement. Fast testing with direct readout, suitable for a wide range of materials and hardness levels. Uses different scales (A, B, C, etc.) for different material types and hardness ranges.

  • Fast, direct readout
  • Multiple scales for different materials
  • Suitable for production testing

View Rockwell Testers →

Microhardness Testers

Vickers or Knoop indentation testing for small areas, thin samples, and precise hardness measurements. Uses much smaller indenters and lower loads than macrohardness testers. Essential for case depth measurements, small feature analysis, and when testing individual phases or microstructural features.

  • Vickers and Knoop test methods
  • Low loads (typically 10g to 1000g)
  • Essential for case depth and small feature analysis

View Microhardness Testers →

Across every stage Blades · Resins · Abrasives · Pads · Suspensions · Etchants

Consumables & Accessories

In addition to equipment, metallography requires various consumables and accessories for sample preparation and examination. Quality consumables are essential for consistent, high-quality results. Browse our complete consumables catalog for all available products.

PACE Technologies DIAMAT monocrystalline diamond suspensions for metallographic polishing

PACE Technologies diamond suspensions are available in a range of particle sizes for progressive polishing stages.

Essential Consumables

Quality consumables are critical at every step of the preparation process:

Accessories

  • Sample holders and fixtures: For securing samples during preparation. Available through equipment accessories.
  • Measuring tools: Calipers, micrometers, and rulers. Essential for sample dimension verification.
  • Safety equipment: Personal protective equipment, fume hoods, safety cabinets. See our Safety Fundamentals guide for requirements.
  • Storage: Sample storage cabinets and organization systems. Important for maintaining sample integrity.
  • Documentation: Labels, markers, and documentation systems. Critical for traceability and quality control.
Lab planning Workflow layout · Utilities · Furniture

Laboratory Setup

A well-designed metallography laboratory arranges equipment in logical workflow sequence (sectioning → mounting → grinding → polishing → microscopy) to minimize sample handling and reduce contamination risk. Allow adequate space for equipment operation and maintenance, and ensure proper ventilation in sectioning and etching areas.

Key utility requirements include water supply for cooling and cleaning, compressed air, proper drainage for chemical waste, and adequate electrical capacity for all equipment. For safety requirements, see our Safety Fundamentals guide. For furniture and layout solutions, see our lab furniture page. Use the Lab Builder tool for personalized layout planning.

Decision guide Match your application to the right equipment family

Selecting Equipment

The right equipment depends on what you cut, mount, and analyse, how many samples you process, and how much precision the work demands. The matrix below maps common applications to the equipment family that handles them best.

Quick Equipment Chooser

If you need to… Start here Why
Cut steel, castings, or general production samples Abrasive cutters Fast, cost-effective; manual for low volume, automated for repeatability and throughput.
Cut PCBs, ceramics, thin samples, or EBSD prep Precision wafering saws Thin diamond/CBN blades minimise sectioning damage on delicate or brittle materials.
Mount standard metal samples for high throughput Compression presses Heat & pressure cure in 5–15 min per cycle; excellent edge retention with phenolic / DAP / mineral-filled resins.
Mount heat-sensitive materials (Al, polymers, composites) Castable systems Room-temperature cure; vacuum impregnation for porous samples; UV cure for fast turnaround.
Learn the craft or set up a low-volume lab Grinder-Polisher Bases (NANO) Operator-controlled; teaches technique; flexible across materials and procedures.
Run a consistent, repeatable preparation lab Semi-automated systems (FEMTO) Programmable force and time; consistent results across operators and batches.
Measure exact removal depth (case depth, thin films, PCB) Controlled-removal polishers (ATTO) Material removal is metered and measured, not estimated.
Prepare EBSD or eliminate subsurface damage Vibratory polishers (GIGA) Low-stress final polish; batch capable; produces a strain-free surface.
Examine and document microstructures Metallurgical microscopes Reflected-light scope with brightfield, darkfield, polarisation, and DIC; digital imaging for documentation.
Measure macro hardness on the production floor Rockwell testers Direct readout, fast cycle, multiple scales for different material classes.
Measure case depth or test individual phases Microhardness testers Vickers / Knoop indents at 10 g–1 kg; required for case-depth profiles and microstructural-feature hardness.

Get Personalized Equipment Recommendations

Not sure which equipment is right for your lab? Use our interactive tool to get personalized equipment and consumable recommendations based on your specific materials, sample requirements, and workflow needs.

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Key Considerations

  • Sample volume: High-volume labs (10+ samples per day) benefit from automation, while low-volume labs may prefer manual systems. Consider both current and projected volume.
  • Material types: Different materials may require specialized equipment or capabilities. For example, soft materials may need vibratory polishing, while hard ceramics may require controlled removal systems or specialized techniques.
  • Precision requirements: Applications requiring high precision (e.g., case depth measurements, thin film analysis, EBSD preparation) may need advanced equipment like controlled removal polishers or vibratory polishers.
  • Budget: Balance initial cost with long-term value and productivity. Consider total cost of ownership including maintenance, consumables, and operator time.
  • Operator skill level: Consider training requirements and ease of use. Manual systems require more skill but offer flexibility, while automated systems reduce operator variability but may have higher initial costs.
  • Space constraints: Ensure adequate space for equipment operation, sample handling, and workflow. Some automated systems require more floor space.
  • Future needs: Plan for growth and changing requirements. Consider equipment that can be upgraded or expanded as needs evolve.

Getting Started

For new laboratories or those setting up their first metallography lab, consider starting with a basic but complete setup:

Start with manual systems and add automation as volume and consistency requirements grow.

Ready to Learn More?

Now that you understand the equipment used in metallography, explore our guides on sample preparation techniques and safety practices.