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304 Stainless Steel

Stainless Steel

Basic Information

Category: Stainless Steel
Material Type: alloy
Alternative Names:
304AISI 30418-8EN 1.4301
Tags:
austeniticcorrosion-resistantfood-grade

Composition & Structure

Composition: Fe-18Cr-8Ni-0.08C
Microstructure: Austenite with some delta ferrite

Description

Most common austenitic stainless steel with excellent corrosion resistance and formability.

Mechanical Properties

Hardness: 123 HB
Hardness (HB): 123 HB
Hardness Category: soft
Tensile Strength: 515 MPa
Yield Strength: 205 MPa

Physical Properties

Density: 8 g/cm³
Melting Point: 1400 °C

Material Characteristics

Work Hardening: Yes
Magnetic: No
Corrosion Resistance: excellent

General Preparation Notes

304 Stainless Steel is a soft (123 HB) austenitic stainless steel (18% Cr, 8% Ni) with an austenitic microstructure that may contain some delta ferrite. The softness requires careful preparation to avoid smearing and deformation. Use low to moderate pressure throughout grinding and polishing to prevent deformation of the soft austenitic matrix. The high chromium and nickel content provides excellent corrosion resistance but can make the material more difficult to etch than carbon steels. Standard stainless steel preparation procedures work well. Monitor for smearing during grinding and polishing - reduce pressure if any deformation is observed. The most common austenitic stainless steel, used extensively in food processing, chemical equipment, and architecture.

Sectioning

Use abrasive cut-off wheel designed for stainless steel (Al₂O₃ or SiC abrasive). Standard cut-off wheel (1.0-1.5 mm thickness) is appropriate. Use adequate coolant flow to prevent overheating - excessive heat can cause sensitization (chromium carbide precipitation) in the heat-affected zone. Cutting speed: 200-300 RPM for most cut-off saws. Apply steady, moderate pressure - the soft material allows for reasonable feed rates. Avoid forcing the cut which can cause wheel wear and sample damage. Leave adequate allowance (~2-3 mm) for grinding away the heat-affected zone from cutting.

Mounting

Cold mounting with epoxy resin is preferred to avoid heat that could affect the microstructure or cause sensitization. Use a low-shrinkage epoxy resin for best edge retention. Ensure complete cure before grinding to prevent edge rounding and maintain sample integrity.

Hot compression mounting is acceptable if the part tolerates ~150-180°C and moderate pressure (2000-3000 psi for phenolic). Use phenolic or epoxy-phenolic resins. The soft material requires careful handling during mounting to avoid deformation. Ensure proper cooling under pressure to minimize shrinkage.

For critical food processing and chemical equipment applications, ensure the mounting material is compatible with the intended use environment.

Grinding

The softness (123 HB) of 304 Stainless Steel requires careful grinding to avoid smearing and deformation. Use standard SiC grinding papers with adequate water lubrication. Disc speed: 200-300 RPM. Apply light to moderate pressure (20-30 N per 30 mm sample) - the soft material is prone to smearing if too much pressure is applied. Use sharp, fresh grinding papers to minimize deformation.

Grinding sequence:
  • 120 grit: Remove sectioning damage (30-60 seconds). Use moderate pressure to remove heat-affected zone.
  • 240 grit: Remove previous scratches (30-60 seconds). Monitor for smearing.
  • 320 grit: Further refinement (30-60 seconds). Ensure complete scratch removal.
  • 400 grit: Refinement (30-60 seconds). Continue scratch removal.
  • 600 grit: Final grinding step (30-60 seconds). Prepare surface for polishing.
Always rotate the specimen holder 90° between steps to ensure complete scratch removal. Use complementary rotation (platen and holder same direction, different speeds) rather than contra-rotation to minimize deformation. Adequate water lubrication is critical - avoid drying during grinding which can cause smearing.
Recommended Sequence:
120240320400600

Polishing

The softness requires careful polishing to avoid smearing and excessive relief. Use diamond polishing with appropriate polishing pads for each stage. Apply light to moderate pressure throughout to prevent deformation.

Diamond polishing sequence:
  • 6μm diamond: 2-4 minutes on a medium-hard synthetic pad (e.g., TEXPAN) with light to moderate pressure (20-25 N per 30 mm sample). Start with 6μm rather than 9μm to minimize damage to the soft material. Monitor for smearing and reduce pressure if needed.
  • 3μm diamond: 2-4 minutes on a medium-hard synthetic pad (e.g., TEXPAN) with light pressure. Continue removing scratches from previous step.
  • 1μm diamond: 2-3 minutes on a soft synthetic pad with lighter pressure (15-20 N). These pads provide gentle material removal suitable for soft stainless steel.
Final polishing:
  • 0.05μm colloidal silica: 1-2 minutes on a soft final polishing pad (e.g., MICROPAD) with very light pressure. Soft pads are recommended for colloidal silica on soft materials and produce a mirror finish. This removes any remaining fine scratches and prepares the surface for etching. Monitor for relief - reduce polishing time if excessive relief develops.
Use appropriate polishing lubricants. The soft material means polishing times should be sufficient but not excessive - avoid over-polishing which can cause relief and affect grain boundary revelation. Monitor the surface frequently under the microscope to check for smearing or excessive relief.
Recommended Sequence:
6μm diamond3μm diamond1μm diamond0.05μm colloidal silica

Etching

304 Stainless Steel responds well to standard austenitic stainless steel etchants. The high chromium and nickel content can make the material more difficult to etch than carbon steels, but several effective etchants are available. Three primary etchants are recommended:

Glyceregia (Chemical Etching) - Primary choice for general microstructure:
  • Composition: 10ml glycerol, 15ml HCl, 5ml HNO₃
  • Preparation: Add acids to glycerol slowly with stirring. Prepare fresh for best results. The glycerol moderates the reaction rate.
  • Application: Immerse sample or swab for 10-30 seconds. Classic general-purpose micro-etchant for austenitic stainless steels. Provides good grain boundary contrast.
  • Reveals: Grain boundaries, grain structure, and twin boundaries clearly. Excellent for general microstructure examination. Good contrast for austenitic structure.
  • Rinse: Immediately with water, then ethanol. Dry with compressed air or warm air to avoid staining.
  • Note: Prepare fresh when needed. Shelf life: several hours. Use in fume hood. The glycerol moderates the reaction - check progress frequently.
10% Oxalic Acid (Electrolytic) - For revealing grain boundaries and structure:
  • Composition: 10g oxalic acid dihydrate (COOH)₂·2H₂O in 100ml distilled water
  • Preparation: Dissolve oxalic acid in water. Solution is stable for several months.
  • Application: Use as electrolyte with stainless steel cathode. Sample is anode. Apply 6V DC at 0.1 A/cm² current density for 30-60 seconds.
  • Reveals: Grain boundaries, twin boundaries, and grain structure. Less aggressive than chemical etchants, good for revealing fine microstructural details. Provides consistent results.
  • Rinse: Immediately with water after etching. Dry with compressed air.
  • Note: Ensure good electrical contact. If no etching occurs, check connections and increase voltage slightly. Electrolytic etching provides more control than chemical etching.
Aqua Regia (Chemical Etching) - For aggressive etching when other methods fail:
  • Composition: 3 parts HCl, 1 part HNO₃ (by volume)
  • Preparation: Mix acids just before use. Prepare fresh - solution is unstable and loses effectiveness quickly.
  • Application: Immerse sample or swab for 5-15 seconds. Very aggressive etchant - use with caution. Good for difficult-to-etch samples or when other etchants fail.
  • Reveals: Grain boundaries and structure. Very aggressive - can over-etch quickly. Use for samples that resist other etchants.
  • Rinse: Immediately with water, then ethanol. Dry with compressed air.
  • Note: Prepare fresh immediately before use. Shelf life: minutes. Use in fume hood with excellent ventilation. Very corrosive - handle with extreme care.
Etching Strategy:
  • Start with Glyceregia for general microstructure examination - it provides good contrast and reveals grain boundaries clearly
  • Use electrolytic 10% oxalic acid for more controlled etching or when chemical etchants are too aggressive
  • Use Aqua Regia only when other etchants fail or for very difficult-to-etch samples
  • Etching time may vary with heat treatment condition - solution-annealed material may etch differently than cold-worked material
  • Always clean and degrease before etching
  • Use short initial etch times (a few seconds), check under the microscope, repeat if needed
  • Check etching progress frequently - over-etching can obscure fine details
  • For food processing applications, ensure proper surface preparation to reveal any contamination or corrosion
  • If delta ferrite is present, it may appear as dark islands in the austenitic matrix
Safety: All etchants are highly corrosive and produce toxic fumes – full PPE (gloves, safety glasses, lab coat), proper fume hood, and appropriate safety measures are mandatory. Aqua Regia is particularly dangerous - use with extreme caution.
Common Etchants:
GlyceregiaAqua RegiaElectrolytic 10% Oxalic

Heat Treatment

Solution annealed at 1050-1100°C

Temperature Parameters

Annealing Temperature: 1050 °C

No standards information available.

Applications

  • Food processing
  • Chemical equipment
  • Architecture

Typical Uses

  • Kitchen equipment
  • Tanks
  • Pipes