Category:
Ceramic
Material Type:
ceramic
Alternative Names:
Tags:
Beryllium Oxide (BeO)
Ceramic
Basic Information
Composition & Structure
Composition:
BeO (wurtzite crystal structure)
Microstructure:
Equiaxed BeO grains with grain boundary phase
Description
Beryllium oxide (beryllia) is a high-performance ceramic with exceptionally high thermal conductivity (250-300 W/m·K), approaching aluminum metal. Used as electronic substrate and heat sink in high-power RF/microwave devices, laser components, and military electronics. SAFETY WARNING: BeO dust is extremely toxic — inhalation causes chronic beryllium disease (berylliosis). All preparation MUST use ventilated enclosure with HEPA filtration and respiratory protection.
Mechanical Properties
Hardness:
1300 HV (9 Mohs)
Hardness (HV):
1300 HV
Hardness Category:
very hard
Tensile Strength:
170-250 MPa (flexural)
Physical Properties
Density:
3.01 g/cm³
Melting Point:
2507 °C
Material Characteristics
Work Hardening:
No
Magnetic:
No
Corrosion Resistance:
excellent
CRITICAL SAFETY: All preparation of BeO MUST be performed in a ventilated enclosure with HEPA filtration. All waste is hazardous beryllium waste. Operators must wear respiratory protection.
Sectioning
Diamond wafering blade - medium grit / low concentration. Continuous coolant. Ventilated enclosure.
Mounting
Castable with epoxy or acrylic. Vacuum impregnation for porous grades.
Grinding
Diamond grinding discs. 70μm diamond disc (planar), 30μm diamond on CERMESH (5 min).
Recommended Sequence:
Polishing
6μm diamond on TEXPAN with SIAMAT (5 min), 1μm diamond on GOLDPAD/ATLANTIS with SIAMAT (5 min), SIAMAT colloidal silica on TEXPAN (5 min).
Recommended Sequence:
Etching
Thermal etching primary (1300-1500°C, 15-30 min in air). Concentrated HF for grain boundaries (extreme safety). Observe as-polished first.
Common Etchants:
Heat Treatment
Sintered at 1500-1800°C. Not heat treated in service.
Standards
- ASTM C708
- ASTM C812
- MIL-PRF-10510
Applications
- Electronic substrates
- High-power RF/microwave heat sinks
- Laser components
- Nuclear reactor components
Typical Uses
- High-power transistor packages
- Traveling wave tube windows
- Microwave power module substrates
- X-ray tube windows