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C51000 Phosphor Bronze

Copper Alloy

Basic Information

Category: Copper Alloy
Material Type: alloy
Alternative Names:
C51000Phosphor Bronze5% Tin Bronze
Tags:
bronzespringwear-resistant

Composition & Structure

Composition: Cu-5Sn-0.2P
Microstructure: Alpha copper with tin-rich phase

Description

Phosphor bronze with excellent spring properties and wear resistance. Used for springs and electrical contacts.

Mechanical Properties

Hardness: 78 HB
Hardness (HB): 78 HB
Hardness Category: soft
Tensile Strength: 380 MPa
Yield Strength: 125 MPa

Physical Properties

Density: 8.86 g/cm³
Melting Point: 1000 °C

Material Characteristics

Work Hardening: Yes
Magnetic: No
Corrosion Resistance: high

Sectioning

Use slow-speed diamond saw or abrasive cut-off wheel designed for non-ferrous materials. Standard cut-off wheel (1.0-1.5 mm thickness) is appropriate. Use adequate coolant flow to prevent overheating and minimize deformation. Cutting speed: 150-250 RPM for most cut-off saws. Apply steady, moderate pressure - the material allows for reasonable feed rates. Avoid forcing the cut which can cause wheel wear and sample damage. Leave adequate allowance (~2-3 mm) for grinding away the heat-affected zone from cutting.

Mounting

Cold mounting with epoxy resin is preferred to avoid heat that could affect the microstructure. Use a low-shrinkage epoxy resin for best edge retention. Ensure complete cure before grinding to prevent edge rounding and maintain sample integrity.

Hot compression mounting is acceptable if the part tolerates ~150-180°C and moderate pressure (2000-3000 psi for phenolic). Use phenolic or epoxy-phenolic resins. Ensure proper cooling under pressure to minimize shrinkage.

Grinding

The softness (78 HB) of C51000 Phosphor Bronze requires careful grinding. Use standard SiC grinding papers with adequate water lubrication. Disc speed: 200-300 RPM. Apply light to moderate pressure (20-30 N per 30 mm sample) - the soft material is prone to smearing if too much pressure is applied. Use sharp, fresh grinding papers to minimize deformation.

Grinding sequence:
  • 240 grit: Remove sectioning damage (20-40 seconds). Use moderate pressure to remove heat-affected zone.
  • 320 grit: Remove previous scratches (20-40 seconds). Ensure complete scratch removal.
  • 400 grit: Remove previous scratches (20-40 seconds). Ensure complete scratch removal.
  • 600 grit: Remove previous scratches (20-40 seconds). Ensure complete scratch removal.
Always rotate the specimen holder 90° between steps to ensure complete scratch removal. Use complementary rotation (platen and holder same direction, different speeds) rather than contra-rotation to minimize deformation. Adequate water lubrication is critical - avoid drying during grinding which can cause smearing.
Recommended Sequence:
240320400600

Polishing

The softness requires careful polishing. Use diamond polishing with appropriate polishing pads for each stage. Apply light to moderate pressure throughout to prevent deformation.

Diamond polishing sequence:
  • 6μm diamond: 2-4 minutes on a soft synthetic pad (e.g., TEXPAN) with light to moderate pressure (20-25 N per 30 mm sample). Start with 6μm to minimize damage. Monitor constantly for smearing and reduce pressure if any deformation is observed.
  • 3μm diamond: 2-4 minutes on a soft synthetic pad (e.g., TEXPAN) with light pressure (15-20 N). Continue removing scratches from previous step.
  • 1μm diamond: 2-3 minutes on a soft synthetic pad with lighter pressure (12-18 N). These pads provide gentle material removal.
  • 0.05μm colloidal silica: 1-2 minutes on a soft final polishing pad (e.g., MICROPAD) with very light pressure. This removes any remaining fine scratches and prepares the surface for etching. Monitor for relief - reduce polishing time if excessive relief develops.
Use appropriate polishing lubricants. The soft material means polishing times should be sufficient but not excessive - avoid over-polishing which can cause relief and affect grain boundary revelation. Monitor the surface frequently under the microscope to check for smearing or excessive relief.
Recommended Sequence:
6μm diamond3μm diamond1μm diamond0.05μm colloidal silica

Etching

C51000 Phosphor Bronze is a single-phase alpha Cu-Sn alloy (95Cu-5Sn-0.2P) with possible tin-rich delta phase at grain boundaries. The phosphorus addition acts as a deoxidizer. Revealing the tin-rich phase requires etchants with good phase contrast. Two primary etchants are recommended:

Copper No. 2 (Chemical Etching) - Primary choice for tin bronze:
  • Composition: 10g FeCl₃, 50ml HCl, 200ml H₂O
  • Application: Immerse for 10-20 seconds, or swab for more controlled results. Good contrast between the alpha matrix and any tin-rich phases.
  • Reveals: Grain boundaries, annealing twins, and tin-rich delta phase when present. The FeCl₃ provides good contrast between the alpha Cu-Sn matrix and secondary phases.
  • Rinse: Immediately with water, then ethanol. Dry with compressed air.
Dichromate Etchant (Chemical Etching) - Best for tin-rich phase contrast:
  • Composition: 2g K₂Cr₂O₇, 8ml H₂SO₄, 4ml saturated NaCl, 100ml H₂O
  • Application: Immerse for 20-60 seconds, or swab for controlled results.
  • Reveals: Grain boundaries and tin-rich delta phase with excellent contrast. The dichromate etchant is specifically effective at revealing the delta (Cu₃₁Sn₈) phase in tin bronzes.
  • Rinse: Immediately with water, then ethanol. Dry with compressed air.
  • Note: CAUTION — K₂Cr₂O₇ is a known carcinogen. Full PPE and fume hood required. Dispose as hazardous waste.
Safety: Dichromate is carcinogenic — handle with full PPE, fume hood, and proper waste disposal. Wear gloves, safety glasses, and lab coat for all etchants.
Common Etchants:
Copper No. 2Dichromate Etchant

Heat Treatment

Annealed

Temperature Parameters

Annealing Temperature: 425 °C

No standards information available.

Applications

  • Springs
  • Bearings
  • Electrical

Typical Uses

  • Springs
  • Bearings
  • Electrical contacts