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Niobium

Refractory Metal

Basic Information

Category: Refractory Metal
Material Type: metal
Alternative Names:
NbColumbiumPure Niobium
Tags:
refractorysuperconductinghigh-melting

Composition & Structure

Composition: Nb-99.9Nb
Microstructure: Body-centered cubic niobium

Description

Refractory metal used in superconducting applications and high-temperature environments.

Mechanical Properties

Hardness: 75 HB
Hardness (HB): 75 HB
Hardness Category: soft
Tensile Strength: 275 MPa
Yield Strength: 105 MPa

Physical Properties

Density: 8.57 g/cm³
Melting Point: 2477 °C

Material Characteristics

Work Hardening: Yes
Magnetic: No
Corrosion Resistance: high

Sectioning

Use abrasive cut-off wheel with adequate coolant flow. Standard cut-off wheel (1.0-1.5 mm thickness) is appropriate. Use adequate coolant flow to prevent overheating. Cutting speed: 200-300 RPM for most cut-off saws. Apply steady, moderate pressure. Avoid forcing the cut which can cause wheel wear and sample damage. Leave adequate allowance (~2-3 mm) for grinding away the heat-affected zone from cutting.

Mounting

Cold mounting with epoxy resin is preferred to avoid heat that could affect the microstructure. Use a low-shrinkage epoxy resin for best edge retention. Ensure complete cure before grinding to prevent edge rounding and maintain sample integrity.

Hot compression mounting is acceptable if the part tolerates ~150-180°C and moderate pressure (2000-3000 psi for phenolic). Use phenolic or epoxy-phenolic resins. Ensure proper cooling under pressure to minimize shrinkage.

Grinding

The softness (75 HB) of Niobium requires careful grinding. Use standard SiC grinding papers with adequate water lubrication. Disc speed: 200-300 RPM. Apply light to moderate pressure (20-30 N per 30 mm sample) - the soft material is prone to smearing if too much pressure is applied. Use sharp, fresh grinding papers to minimize deformation.

Grinding sequence:
  • 240 grit: Remove sectioning damage (20-40 seconds). Use moderate pressure to remove heat-affected zone.
  • 320 grit: Remove previous scratches (20-40 seconds). Ensure complete scratch removal.
  • 400 grit: Remove previous scratches (20-40 seconds). Ensure complete scratch removal.
  • 600 grit: Remove previous scratches (20-40 seconds). Ensure complete scratch removal.
Always rotate the specimen holder 90° between steps to ensure complete scratch removal. Use complementary rotation (platen and holder same direction, different speeds) rather than contra-rotation to minimize deformation. Adequate water lubrication is critical - avoid drying during grinding which can cause smearing.
Recommended Sequence:
240320400600

Polishing

The softness requires careful polishing. Use diamond polishing with appropriate polishing pads for each stage. Apply light to moderate pressure throughout to prevent deformation.

Diamond polishing sequence:
  • 6μm diamond: 2-4 minutes on a soft synthetic pad (e.g., TEXPAN) with light to moderate pressure (20-25 N per 30 mm sample). Start with 6μm to minimize damage. Monitor constantly for smearing and reduce pressure if any deformation is observed.
  • 1μm diamond: 2-4 minutes on a soft synthetic pad (e.g., TEXPAN) with light pressure (15-20 N). Continue removing scratches from previous step.
  • 0.05μm colloidal silica: 1-2 minutes on a soft final polishing pad (e.g., MICROPAD) with very light pressure. This removes any remaining fine scratches and prepares the surface for etching. Monitor for relief - reduce polishing time if excessive relief develops.
Use appropriate polishing lubricants. The soft material means polishing times should be sufficient but not excessive - avoid over-polishing which can cause relief and affect grain boundary revelation. Monitor the surface frequently under the microscope to check for smearing or excessive relief.
Recommended Sequence:
6μm diamond1μm diamond

Etching

Niobium responds well to standard etchants for refractory metal materials. The body-centered cubic niobium will reveal clearly with appropriate etchants. HF Solution (Chemical Etching) - Standard etchant for this material:
  • Application: Follow standard procedures for HF Solution.
  • Reveals: Grain boundaries and microstructure clearly.
  • Rinse: Immediately with water, then ethanol. Dry with compressed air.
  • Note: Use appropriate safety measures. Consult material-specific guidelines.
Electrolytic (Chemical Etching) - Standard etchant for this material:
  • Application: Follow standard procedures for Electrolytic.
  • Reveals: Grain boundaries and microstructure clearly.
  • Rinse: Immediately with water, then ethanol. Dry with compressed air.
  • Note: Use appropriate safety measures. Consult material-specific guidelines.
Etching Strategy:
  • Start with HF Solution for general microstructure examination
  • Always clean and degrease before etching
  • Use short initial etch times (a few seconds), check under the microscope, repeat if needed
  • Check etching progress frequently - over-etching can obscure fine details
Safety: All etchants require proper PPE (gloves, safety glasses, lab coat), proper fume hood, and appropriate safety measures. Handle with care.
Common Etchants:
HF SolutionElectrolytic

Heat Treatment

Annealed

Temperature Parameters

Annealing Temperature: 1000 °C

No standards information available.

Applications

  • Superconducting
  • Aerospace
  • Nuclear

Typical Uses

  • Superconducting magnets
  • Aerospace components
  • Nuclear applications