NFZ System (NANO-FEMTO-ZETA-RC)
Complete automated grinding and polishing workflow with precise control for polycrystalline diamond polishing and final finishing steps.
PACE Technologies' polycrystalline diamond polishing abrasives are designed for rapid material removal with minimal surface damage. Featuring a multi-faceted crystal structure, these abrasives enhance surface leveling and reduce sub-surface deformation, making them ideal for polishing hard and brittle materials.
Use high-viscosity suspensions for aggressive polishing, and low-viscosity for delicate or heat-sensitive materials.
Use low-nap or non-woven polishing pads to optimize abrasive contact and surface finish.
Polycrystalline diamond cuts faster, so reduce polishing time and pressure to prevent over-polishing or relief.
Polycrystalline diamond polishing is a critical step in achieving uniform, high-quality surface finishes during metallographic sample preparation. With its multi-faceted crystal structure, polycrystalline diamond offers superior material removal rates and minimized subsurface damage, especially on hard and brittle materials. These abrasives are best used with low- to medium-napped polishing pads to maintain flatness and avoid issues like relief or edge rounding. Selecting the proper viscosity and suspension format, paired with the right cloth and lubrication, ensures efficient, reproducible polishing results for accurate microstructural analysis.
This reference outlines best-practice abrasive sizes for rough and final polishing across metals, ceramics, and composite materials. Proper abrasive selection is critical to ensure accurate microstructural representation, prevent surface damage, and optimize polishing efficiency.
| Metal | Rough Polishing (Diamond) | Final Polishing (Oxide) | ||||
|---|---|---|---|---|---|---|
| Abrasive Size | 9 µm | 6 µm | 3 µm | 1 µm | Al2O3 | SiO2 |
| Aluminum | ||||||
| Copper / Brass | ||||||
| Stainless Steel | ||||||
| Soft Steel | ||||||
| Hard Steel | ||||||
| Tool Steel | ||||||
| Titanium | Etch Polish | |||||
| Zinc, Tin, Lead | ||||||
| Ceramic / Composite | Coarse Grind | Fine Grind | Rough Polish | Fine Polish | ||
|---|---|---|---|---|---|---|
| Diamond Size | 30 µm | 15 µm | 9 µm | 6 µm | 3 µm | 1 µm + SiO2 |
| Alumina | ||||||
| Silicon Nitride | ||||||
| Polymer Composite | ||||||
| Metal Matrix Composite | ||||||
| Ceramic Matrix Composite | ||||||
| Cermet | ||||||
Note: These selections reflect proven laboratory procedures balancing speed, flatness, and structure preservation. Adjust abrasive types and sequence for material-specific variables such as grain size, hardness, and thermal sensitivity.
Polycrystalline diamond polishing is typically performed in one or two stages depending on material hardness and surface condition. For rough polishing, low- to medium-napped pads are used with coarse polycrystalline diamond suspensions or pastes to efficiently remove grinding damage. In many cases, this may be followed by a finer grade of polycrystalline diamond for surface refinement. Due to the abrasive’s multi-crystalline nature, material removal is rapid yet controlled, minimizing heat and deformation. Excessive polishing should be avoided to prevent artifacts such as relief, smear, or rounding.
To prevent common polishing issues such as edge rounding, relief, or abrasive embedding:
| Description | Quantity | Catalog Number | Product Image |
|---|---|---|---|
| 1 micron (blue) DIAMAT PC Suspension | 1 liter | PC-1001-1L | ![]() |
| 1 micron (blue) DIAMAT PC Suspension | 1 gallon | PC-1001-1GLB | |
| 3 micron (green) DIAMAT PC Suspension | 1 liter | PC-1003-1L | ![]() |
| 3 micron (green) DIAMAT PC Suspension | 1 gallon | PC-1003-1GLG | |
| 6 micron (yellow) DIAMAT PC Suspension | 1 liter | PC-1006-1L | ![]() |
| 6 micron (yellow) DIAMAT PC Suspension | 1 gallon | PC-1006-1GLY | |
| 9 micron (red) DIAMAT PC Suspension | 1 liter | PC-1009-1L | ![]() |
| 9 micron (red) DIAMAT PC Suspension | 1 gallon | PC-1009-1GLR | |
| 15 micron (brown) DIAMAT PC Suspension | 1 liter | PC-1015-1L | ![]() |
| 15 micron (brown) DIAMAT PC Suspension | 1 gallon | PC-1015-1GLBR | |
| 30 micron (orange) DIAMAT PC Suspension | 1 liter | PC-1030-1L | ![]() |
| 30 micron (orange) DIAMAT PC Suspension | 1 gallon | PC-1030-1GLO | |
| 45 micron (purple) DIAMAT PC Suspension | 1 liter | PC-1045-1L | ![]() |
| 45 micron (purple) DIAMAT PC Suspension | 1 gallon | PC-1045-1GLP |
| Description | Quantity | Catalog Number | Product Image |
|---|---|---|---|
| DIAMAT Polycrystalline Diamond Paste (0.1 µm) | 5 gm 20 gm |
PC-0210-05 PC-0210-20 |
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| DIAMAT Polycrystalline Diamond Paste (0.25 µm) | 5 gm 20 gm |
PC-0225-05 PC-0225-20 |
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| DIAMAT Polycrystalline Diamond Paste (0.5 µm) | 5 gm 20 gm |
PC-0250-05 PC-0250-20 |
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| DIAMAT Polycrystalline Diamond Paste (1 µm) | 5 gm 20 gm |
PC-2001-05 PC-2001-20 |
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| DIAMAT Polycrystalline Diamond Paste (3 µm) | 5 gm 20 gm |
PC-2003-05 PC-2003-20 |
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| DIAMAT Polycrystalline Diamond Paste (6 µm) | 5 gm 20 gm |
PC-2006-05 PC-2006-20 |
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| DIAMAT Polycrystalline Diamond Paste (9 µm) | 5 gm 20 gm |
PC-2009-05 PC-2009-20 |
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| DIAMAT Polycrystalline Diamond Paste (15 µm) | 5 gm 20 gm |
PC-2015-05 PC-2015-20 |
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| DIAMAT Polycrystalline Diamond Paste (30 µm) | 5 gm 20 gm |
PC-2030-05 PC-2030-20 |
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| DIAMAT Polycrystalline Diamond Paste (45 µm) | 5 gm 20 gm |
PC-2045-05 PC-2045-20 |
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| Symptom | Cause | Solution |
|---|---|---|
| Coarse Scratching | Contaminated polishing pad or incorrect pad pairing | Replace pad; use correct pad type for polycrystalline diamond |
| Agglomerated Diamond | Pre-mixing with colloidal silica; bacterial growth in suspension | Dispense abrasives separately; replace suspension if contaminated |
| Uneven Polishing | Worn pad or uneven platen surface | Replace pad; check and resurface platen if needed |
| Edge Rounding / Excessive Relief | Too much downforce or extended polishing duration | Reduce force; shorten polishing time; verify prior steps were sufficient |
| Low Polishing Rate | Insufficient abrasive concentration or poor pad saturation | Increase suspension application rate; recharge pad with diamond |
| Tearing of Pad | High pressure or inadequate lubrication | Lower pressure; apply lubricant more frequently |
| Specimen Smear or Pull-Out | Inappropriate pad or overly aggressive abrasive size | Use lower nap pad and finer diamond grit; evaluate pad compatibility |
Complete automated grinding and polishing workflow with precise control for polycrystalline diamond polishing and final finishing steps.
High-capacity vibratory polishing system for batch processing with polycrystalline diamond abrasives.
Common questions about polycrystalline diamond polishing
Polycrystalline diamond consists of many small diamond crystals, providing multiple cutting edges for faster material removal. Monocrystalline diamond has single crystal structure with consistent geometry, offering more controlled and finer polishing. Polycrystalline is preferred for rough polishing and hard materials, while monocrystalline excels at final polishing for superior surface finish.
Polycrystalline diamond is ideal for hard and tough materials including tool steels, carbides, ceramics, cermets, and composite materials. It removes grinding damage quickly on materials that would take excessive time with conventional abrasives. For softer metals like aluminum or copper, consider finer polycrystalline grades or switch to monocrystalline diamond to avoid excessive material removal.
Suspensions (low viscosity) provide excellent lubrication and heat dissipation, ideal for automated systems and extended polishing. Pastes (high viscosity) offer concentrated abrasive delivery and longer pad life, preferred for manual polishing or when frequent recharging is impractical. Sprays provide light, controlled application for final polishing steps. Choose based on equipment type, material, and desired convenience.
Polycrystalline diamond cuts aggressively, so reduce polishing time and pressure compared to conventional abrasives. Start with shorter polishing intervals (1-2 minutes) and inspect frequently. Use low-nap or non-woven pads to minimize embedment. Monitor for signs of relief, rounding, or smearing. Once grinding damage is removed, transition to finer grades or monocrystalline diamond rather than continuing with the same abrasive.
For rough polishing with coarse polycrystalline diamond (15-9 µm), use low-nap pads like CERMESH or GOLDPAD. For intermediate polishing (6-3 µm), use medium-nap pads like MICROPAD or TEXPAN. Non-woven pads provide excellent results across all grades. Avoid high-nap cloths during polycrystalline polishing as they can cause excessive embedment and reduce cutting efficiency.
Polycrystalline diamond can be used for final polishing with 1-3 µm grades on very hard materials where conventional alumina polishing is ineffective. However, for most materials, monocrystalline diamond (1 µm or 0.25 µm) or colloidal silica provides superior final surface finish with less risk of artifacts. Reserve polycrystalline for rough and intermediate stages, then transition to finer abrasives for the final step.