Our precision wafering consumables deliver clean, accurate cuts for delicate materials like semiconductors and ceramics. With diamond wafering blades and specialized cutting fluids, they minimize damage and ensure consistent results for microstructural analysis.
Select a diamond blade suited to the material's brittleness and thickness for precise, clean cuts.
Ensure proper coolant flow to minimize friction and heat, protecting delicate structures.
Use appropriate speeds: lower for fragile materials and higher for tougher ones.
Precision wafer cutting is typically performed with diamond wafering blades, but for certain materials, cubic boron nitride (CBN) blades are more effective. Optimal wafer cutting requires selecting the right abrasive concentration, abrasive size, cutting speed, and load. Precision wafering is essential for delicate samples or precise sectioning, with saw speeds ranging from 50-1500 rpm or 300-3000 rpm. High-speed saws are preferred for hard materials like ceramics, heat-treated steels, and minerals.
The most critical parameter in precision wafering is the abrasive size. Finer abrasives result in less damage, making them ideal for extremely brittle materials like semiconductors and ceramics. Precision wafering saws are used for delicate samples requiring exact cuts, with factors like abrasive concentration, blade grit, and cutting speed all playing crucial roles in achieving optimal results with minimal surface damage.
| Material | Characteristic | Speed (rpm) | Load (grams) | Blade (grit/conc.) |
|---|---|---|---|---|
| Silicon substrate | Soft/Brittle | <300 | <100 | Fine/Low |
| Gallium arsenide | Soft/Brittle | <200 | <100 | Fine/Low |
| Boron composites | Very brittle | 500 | 250 | Fine/Low |
| Ceramic fiber composites | Very brittle | 1000 | 500 | Fine/Low |
| Glasses | Brittle | 1000 | 500 | Fine/Low |
| Minerals | Friable/Brittle | >1500 | >500 | Fine/Low |
| Alumina ceramic | Hard/Tough | >1500 | >500 | Medium/Low |
| Zirconia (PSZ) | Hard/Tough | >3500 | >800 | Medium/Low |
| Silicon nitride | Hard/Tough | >3500 | >800 | Medium/Low |
| Metal matrix composites | -- | >3500 | >500 | Medium/High |
| General purpose | -- | Variable | Variable | Medium/High |
| Application | Conc. | Diamond Size | Thickness | Catalog Number | Product Images |
|---|---|---|---|---|---|
| Brittle materials (microelectronic materials, friable ceramics, minerals) | Low | Fine | 0.006-inch | WB-0030LC |
|
| Hard/tougher ceramics (Si3N4, ZrO2) | Low | Medium | 0.006-inch | WB-0035LC |
|
| Most metal samples | High | Medium | 0.006-inch | WB-0035HC |
|
| Application | Conc. | Diamond Size | Thickness | Catalog Number | Product Images |
|---|---|---|---|---|---|
| Brittle materials (microelectronic materials, friable ceramics, minerals) | Low | Fine | 0.012-inch | WB-0040LC |
|
| Hard/tougher ceramics (Si3N4, ZrO2) | Low | Medium | 0.012-inch | WB-0045LC |
|
| Most metal samples | High | Medium | 0.012-inch | WB-0045HC |
|
| Application | Conc. | Diamond Size | Thickness | Catalog Number | Product Images |
|---|---|---|---|---|---|
| Brittle materials (microelectronic materials, friable ceramics, minerals) | Low | Fine | 0.015-inch | WB-0050LC |
|
| Hard/tougher ceramics (Si3N4, ZrO2) | Low | Medium | 0.015-inch | WB-0055LC |
|
| Most metal samples | High | Medium | 0.015-inch | WB-0055HC |
|
| Application | Conc. | Diamond Size | Thickness | Catalog Number | Product Images |
|---|---|---|---|---|---|
| Brittle materials (microelectronic materials, friable ceramics, minerals) | Low | Fine | 0.018-inch | WB-0060LC |
|
| Hard/tougher ceramics (Si3N4, ZrO2) | Low | Medium | 0.018-inch | WB-0065LC |
|
| Most metal samples | High | Medium | 0.018-inch | WB-0065HC |
|
| Application | Conc. | Diamond Size | Thickness | Catalog Number | Product Images |
|---|---|---|---|---|---|
| Brittle materials (microelectronic materials, friable ceramics, minerals) | Low | Fine | 0.020-inch | WB-0070LC |
|
| Hard/tougher ceramics (Si3N4, ZrO2) | Low | Medium | 0.020-inch | WB-0075LC |
|
| Most metal samples | High | Medium | 0.020-inch | WB-0075HC |
|
| Application | Conc. | Diamond Size | Thickness | Catalog Number | Product Images |
|---|---|---|---|---|---|
| Brittle materials (microelectronic materials, friable ceramics, minerals) | Low | Fine | 0.024-inch | WB-0080LC |
|
| Hard/tougher ceramics (Si3N4, ZrO2) | Low | Medium | 0.024-inch | WB-0085LC |
|
| Most metal samples | High | Medium | 0.024-inch | WB-0085HC |
|
| Application | Conc. | Diamond Size | Thickness | Catalog Number | Product Images |
|---|---|---|---|---|---|
| 4-inch electroplated diamond wafering blade (soft gummy materials such as plastics, rubber, and soft metals) | Low | Fine | 0.030-inch | WB-040EPD |
|
| 5-inch electroplated diamond wafering blade (soft gummy materials such as plastics, rubber, and soft metals) | Low | Medium | 0.030-inch | WB-050EPD |
|
| 6-inch electroplated diamond wafering blade (soft gummy materials such as plastics, rubber, and soft metals) | High | Medium | 0.030-inch | WB-060EPD |
|
| 7-inch electroplated diamond wafering blade (soft gummy materials such as plastics, rubber, and soft metals) | High | Medium | 0.030-inch | WB-070EPD |
|
| 8-inch electroplated diamond wafering blade (soft gummy materials such as plastics, rubber, and soft metals) | High | Medium | 0.030-inch | WB-080EPD |
|
| Application | Conc. | Diamond Size | Thickness | Catalog Number | Product Images |
|---|---|---|---|---|---|
| 4-inch CBN wafering blade (medium grit, high concentration) | High | Medium | 0.012-inch | WCBN-0045 |
|
| 5-inch CBN wafering blade (medium grit, high concentration) | High | Medium | 0.015-inch | WCBN-0055 |
|
| 6-inch CBN wafering blade (medium grit, high concentration) | High | Medium | 0.018-inch | WCBN-0065 |
|
| 7-inch CBN wafering blade (medium grit, high concentration) | High | Medium | 0.020-inch | WCBN-0075 |
|
| 8-inch CBN wafering blade (medium grit, high concentration) | High | Medium | 0.024-inch | WCBN-0085 |
|
| Application | Conc. | Diamond Size | Thickness | Catalog Number | Product Images |
|---|---|---|---|---|---|
| 4-inch CBN/Diamond Hybrid Wafering Blade (medium grit, high concentration) | High | Medium | 0.012-inch | WCBND-0045 |
|
| 5-inch CBN/Diamond Hybrid Wafering Blade (medium grit, high concentration) | High | Medium | 0.015-inch | WCBND-0055 |
|
| 6-inch CBN/Diamond Hybrid Wafering Blade (medium grit, high concentration) | High | Medium | 0.018-inch | WCBND-0065 |
|
| 7-inch CBN/Diamond Hybrid Wafering Blade (medium grit, high concentration) | High | Medium | 0.020-inch | WCBND-0075 |
|
| 8-inch CBN/Diamond Hybrid Wafering Blade (medium grit, high concentration) | High | Medium | 0.024-inch | WCBND-0085 |
|
| Description | Quantity | Catalog Number | Product Images |
|---|---|---|---|
| DIACUT™ Water-based wafer cutting fluid | 16 oz (0.47l) 32 oz (0.94l) |
WL-3000-16 WL-3000-32 |
|
| DIACUT™ 2 Water-based wafer cutting fluid with anti-corrosion additive | 16 oz (0.47l) 32 oz (0.94l) |
WL2-3000-16 WL2-3000-32 |
|
| DIACUT™ Oil-based wafer cutting fluid | 16 oz (0.47l) 32 oz (0.94l) |
OL-3000-16 OL-3000-32 |
|
| Description | Quantity | Catalog Number |
|---|---|---|
| DIACUT Dressing sticks (medium grit) | Each | DRES-0010 |
| Symptom | Cause | Action |
|---|---|---|
| Chipped or broken blade | Improper blade dressing Insufficient clamping Too high initial load | Use mechanical dressing fixture Secure specimen with rubber pad Reduce initial load |
| Excessive blade wobble | Too high cutting load | Reduce applied load Use larger diameter support flanges |
| Low cutting rates | Smeared material on the blade Too low cutting speed/load | Redress blade Increase cutting speed/load Rotate specimen to minimize cutting area |
| Excessive specimen damage or chipping | Too large an abrasive Excessive vibration | Use finer grit diamond blade Secure specimen with rubber mounting pad |
| Burr formation on specimen at end of cut | Too high load/speed at end of cut Excessive vibration | Reduce speed/load Secure specimen with rubber mounting pads |
PACE Technologies' PICO precision wafering saws deliver precise, low-damage cuts for metallographic analysis. Available in gravity feed and table feed models, these systems provide efficient sample preparation while preserving microstructural integrity for semiconductors, ceramics, and delicate materials.
Common questions about precision wafering and blade selection
Precision wafering uses thin diamond blades (0.012" to 0.024") at high speeds for low-deformation cuts on delicate materials like semiconductors and ceramics. Abrasive cutting uses thicker resin-bonded blades for general metallographic sectioning. Wafering minimizes surface damage and is ideal for heat-sensitive or brittle specimens requiring minimal material removal.
Blade selection depends on material brittleness and composition. For brittle materials like microelectronics and friable ceramics, use low concentration fine diamond blades. For harder, tougher ceramics (Si₃N₄, ZrO₂), use low concentration medium grit blades. For soft, gummy materials like plastics or rubber, electroplated diamond blades prevent loading. Consult our blade selection guide on this page or contact our applications team for specific recommendations.
We recommend DIACUT™ water-based wafering fluid for most applications. For materials prone to corrosion, use DIACUT™ 2 with anti-corrosion additives. Proper cutting fluid cools the blade, lubricates the cut, and flushes debris. Always maintain adequate fluid flow and replace when contaminated to ensure optimal blade performance and cut quality.
To maximize blade life: 1) Use appropriate cutting speeds (higher for soft materials, lower for hard/brittle ones), 2) Maintain consistent, adequate coolant flow, 3) Dress the blade periodically with DIACUT dressing sticks to expose fresh diamond, 4) Avoid excessive feed pressure, 5) Store blades properly when not in use, and 6) Ensure specimens are securely mounted to prevent vibration. Following recommended procedures for your material type will significantly extend blade life.
CBN (Cubic Boron Nitride) blades excel at cutting ferrous materials, hardened steels, and superalloys where diamond blades wear quickly due to chemical reactivity with iron. CBN/Diamond hybrid blades combine the benefits of both abrasives, offering versatility for mixed-material samples or applications requiring both hardness and thermal stability. Use high-concentration CBN blades for consistent, long-life performance on steel-based materials.
Chipping and cracking typically result from excessive feed pressure, improper blade selection, insufficient coolant, or vibration from loose specimen mounting. To prevent damage: reduce feed rate for brittle materials, select finer grit blades with lower concentration, ensure adequate coolant flow, secure specimens firmly, and use lower cutting speeds for fragile samples. Refer to our troubleshooting section for specific solutions to common cutting problems.