ATTO-1000S - Controlled Removal Quantitative Grinding Machine
ATTO-1000S Controlled Removal Quantitative Grinding Machine
Item ID: ATTO-1000S
The ATTO-1000S delivers micron-level precision for quantitative grinding and polishing of semiconductor wafers, optical components, integrated circuits, and metallographic samples. Engineered for parallel grinding, quantitative thinning, and continuous slicing with real-time monitoring and 0.2 micron resolution. Ideal for SEM, FIB, TEM, AFM, EBSD, and petrographic analysis.
Features
- Quantitative material removal with real-time monitoring and 0.2 micron resolution
- Micron-level accuracy for parallel grinding, polishing, and quantitative thinning
- 7-inch touchscreen with programmable process parameter storage for repeatable results
- Micrometer-adjustable pitch and roll control with variable oscillation and rotation
Technical Specifications
| Parameter | Specification |
|---|---|
| Working Wheel | 8" or 10" diameter (203mm or 254mm) with flatness < 2µm |
| Wheel Speed | 0-350 rpm, continuously variable, CW/CCW rotation |
| Head Speed | 0-150 rpm (in 1 rpm increments), CW/CCW rotation |
| Sample Movement | Micrometer adjustable pitch and roll control with adjustable oscillation and rotation amplitude |
| Sample Load | 0-300 grams |
| Drive Mechanism | 750W Servo Motor with Torque Control |
| Maximum Removal Capacity | 10mm (0.4 inches) |
| Precision | Perpendicularity to disk < 2µm; Parallelism < 2µm; Removal accuracy ±2µm |
| LCD Display | 7-inch touchscreen with real-time removal monitoring, 0.2 micron resolution |
| Process Memory | 16 programmable process parameter sets for repeatable workflows |
| Dimensions (WxDxH) | 27.6 x 16.9 x 22.8 inches (700 x 430 x 580 mm) |
| Weight | 125.7 lbs (57 kg) |
| Part Number | ATTO-1000S |
