Sectioning
Sectioning is the critical first step in metallographic sample preparation. Our precision cutting equipment and consumables deliver clean, damage-free cuts with minimal deformation and heat-affected zones. Abrasive sectioning systems (MEGA series) provide fast, efficient cutting for hardened steels and non-ferrous alloys, while precision wafering saws (PICO series) excel with delicate materials, composites, and applications requiring minimal damage. Key considerations include blade selection, cutting speed, feed rate, and cooling fluid to optimize cut quality and extend blade life. Our consumables include abrasive and diamond blades, cutting fluids with corrosion inhibitors, and accessories for various sample sizes and materials.
Mounting
Mounting protects samples and provides edge retention during grinding and polishing. Compression mounting uses heat and pressure to encapsulate samples in thermosetting resins (phenolic, diallyl phthalate, or epoxy) for excellent edge retention and durability. Our TERAPRESS mounting presses offer hydraulic and pneumatic options with precise temperature and pressure control. Castable mounting is ideal for heat-sensitive or delicate samples, using cold-cure resins applied under vacuum (TERAVAC), pressure (TERACOMP), or UV curing (TERAUV). Mounting materials include conductive options for SEM analysis, transparent resins for edge observation, and various hardness levels to match sample properties. Proper mounting prevents edge rounding, protects fragile features, and ensures consistent results.
Grinding
Grinding removes sectioning damage and establishes a flat surface with controlled scratch patterns. Our PENTA hand and belt grinders provide consistent material removal for initial surface preparation. Grinding consumables include SiC grinding papers (P120 to P4000 grit) for progressive scratch reduction, diamond grinding discs for hard materials and faster removal, composite disks that combine multiple grits for streamlined workflows, and lapping films for precision flatness. The grinding sequence typically progresses from coarse (P120-P240) to fine (P800-P1200) grits, removing previous scratches while maintaining flatness. Proper grinding technique minimizes subsurface damage and prepares the surface for polishing. Equipment selection depends on sample size, material hardness, and throughput requirements.
Polishing
Rough polishing removes grinding scratches and refines surface finish using diamond compounds on polishing pads. Our NANO (manual), FEMTO (semi-automatic), and ATTO (controlled removal) grinder-polishers provide precise control over material removal and surface quality. Polishing consumables include diamond suspensions (polycrystalline and monocrystalline) in various particle sizes (9µm to 0.25µm), polishing pads (synthetic, silk, or canvas) matched to material and application, and magnetic polishing systems for easy pad changes. The polishing sequence typically uses 9µm, 6µm, 3µm, and 1µm diamond compounds, progressively removing scratches while maintaining flatness. Proper pad selection, compound concentration, and rotation speed are critical for optimal results. This step prepares the surface for final polishing or can serve as the final step for many applications.
Final Polishing
Final polishing eliminates subsurface damage and achieves mirror-like finishes essential for high-resolution analysis. Our GIGA vibratory polishers provide gentle, uniform surface finishing ideal for EBSD preparation, TEM sample preparation, and applications requiring minimal deformation. Final polishing consumables include colloidal silica suspensions (0.05µm) for oxide polishing, alumina suspensions for non-ferrous materials, and specialized polishing cloths (chemotextile, napless) designed for final polishing. The vibratory motion eliminates directional scratches and produces isotropic surfaces. This step is critical for electron microscopy (SEM, TEM, EBSD), where surface quality directly impacts image resolution and analysis accuracy. Proper final polishing reveals true microstructural features without artifacts from preparation damage.
Etching
Etching reveals microstructural features by selective chemical attack, highlighting grain boundaries, phases, and other important characteristics. Our comprehensive range of etchants includes standard solutions (nital, picral, Vilella's reagent) and specialized formulations for specific materials and applications. Cleaning removes polishing residues, oils, and contaminants that can interfere with etching and analysis. Proper cleaning ensures accurate etching results and prevents contamination. Etchant selection depends on material composition, heat treatment, and the features you want to reveal. Application methods include swabbing, immersion, and electrolytic etching for different materials and requirements. Our etchants database provides detailed information on composition, application, and results for hundreds of materials. Safety data sheets (SDS) are available for all chemical reagents.
Hardness Testing
Hardness testing provides quantitative measurement of material resistance to deformation, essential for quality control, material characterization, and heat treatment verification. Our equipment includes microhardness testers (Vickers, Knoop) for small features and thin sections, Rockwell testers for rapid production testing, and Brinell/MacroVickers testers for larger indentations. Hardness testing consumables include calibration blocks (certified reference materials) for tester verification, indenter tips (diamond, tungsten carbide) in various geometries, and test blocks for daily verification. Proper sample preparation is critical: surfaces must be flat, polished, and free of contamination for accurate results. Hardness values correlate with material strength, wear resistance, and other mechanical properties, making this a fundamental characterization technique in materials science and quality control.
Microscopy & Analysis
Microscopy and analysis enable detailed examination of microstructures, phase identification, and quantitative measurements. Our metallurgical microscopes provide brightfield, darkfield, and polarized light illumination for comprehensive microstructural analysis. Stereo microscopes offer 3D visualization for surface features, defects, and macro-scale examination. Digital imaging systems capture high-resolution images for documentation, analysis, and reporting. Image analysis software provides quantitative measurements including grain size, phase fraction, inclusion content, and dimensional analysis. Advanced systems support automated analysis, batch processing, and integration with laboratory information systems. Proper illumination, magnification selection, and image calibration are essential for accurate analysis. Our microscopy solutions support both research applications requiring high resolution and production environments needing rapid, repeatable measurements.
Additional Resources
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Preparation Guides
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