The key to proper specimen preparation of hard / brittle ceramic matrix composite materials is to first section it with the appropriate diamond wafer blade, grind with as fine a semi-fixed abrasive, followed by the use of CMP (chemical mechanical polishing) techniques.
SECTIONING
Diamond Wafering blade - medium grit / low concentration
MOUNTING
Castable Mounting with Epoxy or Acrylic resins
POLISHING
Abrasive/surface |
Lubricant |
Force/ sample |
Speed |
Time |
| 30 um DIAMAT diamond suspension on CERMESH Metal Mesh cloth | 5-10 lbs | 200/200 rpm |
Until plane | |
| 9 um DIAMAT diamond on POLYPAD polishing pad | DIALUBE Purple Extender | 5-10 lbs | 200/200 rpm |
5 minutes |
| 6 um DIAMAT diamond on TEXPAN polishing pad | SIAMAT colloidal silica | 10 lbs | 200/200 rpm |
5 minutes |
1 um DIAMAT diamond on GOLDPAD polishing pad |
SIAMAT colloidal silica |
10 lbs |
200/200 rpm |
5 minutes |
SIAMAT Colloidal silca on BLACKCHEM 2 polishing pad |
|
10 lbs |
100/100 rpm |
5 minutes |
 |
SiC particles in a Si3N4 matrix , 1000X (DIC) |