Specimen preparation of hard/brittle ceramics can be challenging. The key to the preparation of ceramics and ceramic-ceramic composites is to minimize damage at each preparation stage. This includes sectioning with the appropriate diamond wafering blade and using the finest practical abrasive for initial grinding. Polishing with SIAMAT colloidal silica provides a chemical mechanical polishing (CMP) action which is the most effective means for eliminating both surface and subsurface damage. The combination of SIAMAT colloidal silica with DIAMAT polycrystalline diamond also produces the required surfaces finishes in a minimal amount of time.
SECTIONING
Diamond Wafering blade - medium grit / low concentration
MOUNTING
Castable Mounting with Epoxy or Acrylic resins
POLISHING
Abrasive/surface |
Lubricant |
Force/ sample |
Speed |
Time |
| 30 um DIAMAT diamond suspension on CERMESH Metal Mesh cloth | 5-10 lbs | 200/200 rpm |
Until plane | |
| 9 um DIAMAT diamond on POLYPAD polishing pad | DIALUBE Purple Extender | 5-10 lbs | 200/200 rpm |
5 minutes |
| 6 um DIAMAT diamond on TEXPAN polishing pad | SIAMAT colloidal silica | 10 lbs | 200/200 rpm |
5 minutes |
1 um DIAMAT diamond on GOLDPAD polishing pad |
SIAMAT colloidal silica |
10 lbs |
200/200 rpm |
5 minutes |
SIAMAT Colloidal silca on BLACKCHEM 2 polishing pad |
|
10 lbs |
100/100 rpm |
5 minutes |
 |
20% SIC - 80% ZrB2 Ceramic, 1000X (DIC), as polished condition |