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SiC particles in Aluminum Matrix (MMC)
Specimen Preparation (Class 9 Procedures)
Metallographic Class 9 sample preparation

Hard particles in a metal matrix can be difficult to microstructurally prepare because of particle pull-out as well as excessive relief between the particles and the matrix. The key to preparation of metal matrix composites (MMC) is to minimize damage at each preparation stage. This includes sectioning with the appropriate diamond wafering blade and using the finest practical abrasive for initial grinding. Polishing with SIAMAT colloidal silica provides a chemical mechanical polishing (CMP) action which is the most effective means for eliminating both surface and subsurface damage. The combination of SIAMAT colloidal silica with DIAMAT polycrystalline diamond also produces the required surfaces finishes in a minimal amount of time.

SECTIONING
Diamond Wafering blade - medium grit / low concentration

MOUNTING
Castable Mounting with Epoxy or Acrylic resins.

POLISHING
Abrasive/surface Lubricant Force/ sample Speed
(Head/base)
Time Individual
Force mode
Central Force
mode
70 micron diamond grinding disk*
Water 5-10 lbs 200/200 rpm Planar
  Metallographic central polishing force
30 um DIAMAT diamond
suspension on CERMESH Metal
Mesh cloth
  5-10 lbs 200/200 rpm 5 min Metallographic individual polishing force Metallographic central polishing force
9 um DIAMAT diamond on
POLYPAD polishing pad
DIALUBE Purple
Extender
5-10 lbs 200/200 rpm 5 min Metallographic individual polishing force Metallographic central polishing force
3 um DIAMAT diamond
on GOLDPAD or
ATLANTIS polishing pad
  5-10 lbs 200/200 rpm 5 min Metallographic individual polishing force Metallographic central polishing force
SIAMAT Colloidal silca
on TEXPAN polishing pad
  5-10 lbs 200/200 rpm 5 min Metallographic individual polishing force Metallographic central polishing force

*Required for central polishing force. Click here for more information on central vs. individual polishing force polishing.

Metallographic micrograph of SiC-aluminum MMC composite
SiC particles in an Aluminum Matrix, 400X (DIC)

Common Etchants
PACE Technologies Recommended Etchants

PACE Technologies Etchant Database

CAUTION:Safety is very important when etching. Be sure to wear the appropriate protective clothing and observe all WARNINGS on chemical manufacuters SDS (Safety Data Sheets). Also review the COMMENTS and CONDITIONS Section for each etchant.


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email: pace@metallographic.com
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