Specimen preparation of hard/brittle ceramic matrix composites materials can be challenging. The key to the preparation of ceramics and ceramic-ceramic composites is to minimize damage at each preparation stage. This includes sectioning with the appropriate diamond wafering blade and using the finest practical abrasive for initial grinding. Polishing with SIAMAT colloidal silica provides a chemical mechanical polishing (CMP) action which is the most effective means for eliminating both surface and subsurface damage. The combination of SIAMAT colloidal silica with DIAMAT polycrystalline diamond also produces the required surfaces finishes in a minimal amount of time.

SECTIONING

Diamond Wafering blade - medium grit / low concentration

MOUNTING

Castable Mounting with Epoxy or Acrylic resins

POLISHING

Abrasive/surface	Lubricant	Force/ sample	Speed (Head/base)	Time	Individual Force mode	Central Force mode
70 micron diamond grinding disk*	Water	5-10 lbs	200/200 rpm	Until plane
30 um DIAMAT diamond suspension on CERMESH Metal Mesh cloth		5-10 lbs	200/200 rpm	5 minutes
9 um DIAMAT diamond on POLYPAD polishing pad	DIALUBE Purple Extender	5-10 lbs	200/200 rpm	5 minutes
6 um DIAMAT diamond on TEXPAN polishing pad	SIAMAT colloidal silica	10 lbs	200/200 rpm	5 minutes
1 um DIAMAT diamond on GOLDPAD or ATLANTIS polishing pad	SIAMAT colloidal silica	10 lbs	200/200 rpm	5 minutes
SIAMAT Colloidal silca on BLACKCHEM 2 polishing pad		10 lbs	100/100 rpm	5 minutes

*Required for central polishing force. Click here for more information on central vs. individual polishing force polishing.

Hafnium Diboride in a Boron Nitride Matrix

ETCHING

Common Etchants

CAUTION:Safety is very important when etching. Be sure to wear the appropriate protective clothing and observe all WARNINGS on chemical manufacuters SDS (Safety Data Sheets). Also review the COMMENTS and CONDITIONS Section for each etchant.

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