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PACE Technologies Metallographic Preparation CLASS Chart icon

Hafnium Diboride in a Boron Nitride Matrix (CMC)
Specimen Preparation (Class 10 Procedures)
Metallographic Class 10 sample preparation  

Specimen preparation of hard/brittle ceramic matrix composites materials can be challenging. The key to the preparation of ceramics and ceramic-ceramic composites is to minimize damage at each preparation stage. This includes sectioning with the appropriate diamond wafering blade and using the finest practical abrasive for initial grinding. Polishing with SIAMAT colloidal silica provides a chemical mechanical polishing (CMP) action which is the most effective means for eliminating both surface and subsurface damage. The combination of SIAMAT colloidal silica with DIAMAT polycrystalline diamond also produces the required surfaces finishes in a minimal amount of time.

SECTIONING
Diamond Wafering blade - medium grit / low concentration

MOUNTING
Castable Mounting with Epoxy or Acrylic resins.

POLISHING
Abrasive/surface Lubricant Force/ sample Speed
(Head/base)
Time Individual
Force mode
Central Force
mode
70 micron diamond grinding disk*
Water 5-10 lbs 200/200 rpm Planar
  Metallographic central polishing force
30 um DIAMAT diamond
suspension on CERMESH Metal
Mesh cloth
  5-10 lbs 200/200 rpm 5 min Metallographic individual polishing force Metallographic central polishing force
9 um DIAMAT diamond on
POLYPAD polishing pad
DIALUBE Purple
Extender
5-10 lbs 200/200 rpm 5 min Metallographic individual polishing force Metallographic central polishing force
6 um DIAMAT diamond
on TEXPAN polishing pad
SIAMAT
colloidal silica
10 lbs 200/200 rpm 5 min Metallographic individual polishing force Metallographic central polishing force
1 um DIAMAT diamond
on GOLDPAD or ATLANTIS
polishing pad
SIAMAT
colloidal silica
10 lbs 200/200 rpm 5 min Metallographic individual polishing force Metallographic central polishing force
SIAMAT Colloidal silca on
BLACKCHEM 2 polishing pad
  10 lbs 200/200 rpm 5 min Metallographic individual polishing force Metallographic central polishing force

*Required for central polishing force. Click here for more information on central vs. individual polishing force polishing.

Metallograhic micrograph of hafnium diboride in boron nitride matrix
Hafnium Diboride in a Boron Nitride Matrix

Common Etchants
PACE Technologies Recommended Etchants

PACE Technologies Etchant Database

CAUTION:Safety is very important when etching. Be sure to wear the appropriate protective clothing and observe all WARNINGS on chemical manufacuters SDS (Safety Data Sheets). Also review the COMMENTS and CONDITIONS Section for each etchant.


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