Microelectromechanical (MEMS) Device
Specimen Preparation (Class 4 Procedures)
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Microelectromechanical systems (MEMS) devices are also referred to as micromachines. MEMS devices are made up of components varying in size between 1 micron to 0.1 mm.
Microstructural cross section preparation of MEMS devices presents the same challenges as polishing other specimens having material properties ranging from very hard and brittle (silicon, ceramics, etc.) to soft and ductile (soft metals, metallized layers, sputter coating, etc.). Specimen preparation must eliminate any preparation induced artifacts, as well as maintain the planarity of the specimen.
SECTIONING
Diamond wafering blade - medium grit/low concentration (if required)
MOUNTING
Castable epoxy or acrylic resins
POLISHING
| Abrasive/surface | Lubricant | Force/ sample | Speed (Head/base) |
Time | Individual Force mode |
Central Force mode |
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| 360 grit SiC paper* |
Water |
5-10 lbs | 200/200 rpm | Planar |
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| 600 grit SiC paper |
Water |
5-10 lbs | 100/100 rpm | 1 min |
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| 1 um DIAMAT diamond on TEXPAN polishing pad |
10 lbs | 100/100 rpm | 3-5 min | |
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| SIAMAT colloidal
silica on a BLACKCHEM 2 polishing pad |
5-10 lbs | 100/100 rpm | 3-5 min | |
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*Required for central polishing force. Click here for more information on central vs. individual polishing force polishing.
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| Aluminum-silicon substrate MEMS device with a gold bond on a nickel intermediate layer, Mag. 200X, as polished |
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| Wire bond for MEMS device, 200X, as polished |
ETCHING
Common Etchants
CAUTION:Safety is very important when etching. Be sure to wear the appropriate protective clothing and observe all WARNINGS on chemical manufacuters SDS (Safety Data Sheets). Also review the COMMENTS and CONDITIONS Section for each etchant.
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