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PACE Technologies Metallographic Preparation CLASS Chart icon

Microelectromechanical (MEMS) Device
Specimen Preparation (Class 4 Procedures)
Metallographic Class 4 sample preparation  

Microelectromechanical systems (MEMS) devices are also referred to as micromachines. MEMS devices are made up of components varying in size between 1 micron to 0.1 mm.

Microstructural cross section preparation of MEMS devices presents the same challenges as polishing other specimens having material properties ranging from very hard and brittle (silicon, ceramics, etc.) to soft and ductile (soft metals, metallized layers, sputter coating, etc.). Specimen preparation must eliminate any preparation induced artifacts, as well as maintain the planarity of the specimen.

SECTIONING
Diamond wafering blade - medium grit/low concentration (if required)

MOUNTING
Castable epoxy or acrylic resins

POLISHING
Abrasive/surface Lubricant Force/ sample Speed
(Head/base)
Time Individual
Force mode
Central Force
mode
360 grit SiC paper*
Water
5-10 lbs 200/200 rpm Planar
  Metallographic central polishing force
600 grit SiC paper
Water
5-10 lbs 100/100 rpm 1 min
Metallographic individual polishing force Metallographic central polishing force
1 um DIAMAT diamond
on TEXPAN polishing pad
  10 lbs 100/100 rpm 3-5 min Metallographic individual polishing force Metallographic central polishing force
SIAMAT colloidal silica
on a BLACKCHEM 2
polishing pad
  5-10 lbs 100/100 rpm 3-5 min Metallographic individual polishing force Metallographic central polishing force

*Required for central polishing force. Click here for more information on central vs. individual polishing force polishing.

Aluminum silicon substrate MEMS device with a gold bond on a nickel layer
Aluminum-silicon substrate MEMS device with a gold bond
on a nickel intermediate layer, Mag. 200X, as polished
Electronic die cross section microstructure
Wire bond for MEMS device, 200X, as polished

ETCHING

Common Etchants
PACE Technologies Recommended Etchants

PACE Technologies Etchant Database

CAUTION:Safety is very important when etching. Be sure to wear the appropriate protective clothing and observe all WARNINGS on chemical manufacuters SDS (Safety Data Sheets). Also review the COMMENTS and CONDITIONS Section for each etchant.


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