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PACE Technologies Metallographic Preparation CLASS Chart icon

Solder Joints on Ceramic Substrates
Specimen Preparation (Class 4 Procedures)
Metallographic Class 4 sample preparation  

The microstructural preparation of electronic packages presents some very difficult challenges, such as abrasives embedding in very soft solder joints, edge rounding, polishing relief between very hard (ceramic) or brittle (silicon) materials and the very soft plastic and metal solders. The use of alumina lapping films are very useful for maintaining flatness and for minimizing fractured abrasive embedding for non-ceramic substrates. For specimens with ceramic substrates, diamond lapping films are recommended.

SECTIONING
Diamond Wafering blade - medium grit / low concentration)

MOUNTING
Castable Mounting with Epoxy or Acrylic resins

POLISHING
Abrasive/surface Lubricant Force/ sample Speed
(Head/base)
Time Individual
Force mode
Central Force
mode
30 um Diamond Lapping Film*
POLYLUBE Diamond
Extender
5-10 lbs 200/200 rpm Planar

  Metallographic central polishing force
15 um Diamond Lapping Film*
POLYLUBE Diamond
Extender
5-10 lbs 200/200 rpm 3 min Metallographic individual polishing force Metallographic central polishing force
9 um Diamond Lapping Film*
POLYLUBE Diamond
Extender
5-10 lbs 200/200 rpm 2 min Metallographic individual polishing force Metallographic central polishing force
6 um Diamond Lapping Film*
POLYLUBE Diamond
Extender
5-10 lbs 200/200 rpm 2 min Metallographic individual polishing force Metallographic central polishing force
3 um Diamond Lapping Film*
POLYLUBE Diamond
Extender
5-10 lbs 200/200 rpm 2 min Metallographic individual polishing force Metallographic central polishing force
1 um DIAMAT diamond
on ATLANTIS polishing pad
DIALUBE Purple
Lubricant
5-10 lbs 200/200 rpm 1 min Metallographic individual polishing force Metallographic central polishing force
MICROPAD or MICROPAD 2
polishing pad
Colloidal silica 5-10 lbs 200/200 rpm 30 sec Metallographic individual polishing force Metallographic central polishing force

*Required for central polishing force. Click here for more information on central vs. individual polishing force polishing.

Electronic die on a ceramic substrate microsctructure
Electronic die cross section.
Electronic die cross section microstructure
Electronic die cross section

ETCHING

Common Etchants
PACE Technologies Recommended Etchants

PACE Technologies Etchant Database

CAUTION:Safety is very important when etching. Be sure to wear the appropriate protective clothing and observe all WARNINGS on chemical manufacuters SDS (Safety Data Sheets). Also review the COMMENTS and CONDITIONS Section for each etchant.


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