Tough Pitch Copper
Specimen Preparation (Class 1 Procedures)
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Copper and copper alloys are difficult to prepare because they have a tendency to work harden and have oxide inclusions. The result is that the oxide inclusions can become dislodged and scratch the surface. This scratching is more apparent following etching.
To minimize oxide pull-out, preparation damage can be minimized by using alumina grinding papers and polishing with polycrystalline diamond for the intermediate polishing step, followed by polishing with polycrystalline alumina.
SECTIONING
MAXCUT Abrasive blade (Cat. No. MAX-C or MAX-I series)
MOUNTING
Compression Mounting with Phenolic, Epoxy or Diallyl Phthalate compression mounting resins
POLISHING
| Abrasive/surface | Lubricant | Force/ sample | Speed (Head/base) |
Time | Individual Force mode |
Central Force mode |
|---|---|---|---|---|---|---|
| P120 grit ALO paper* P220 grit ALO paper* |
Water | 5-10 lbs | 100/100 rpm | Planar 1 min |
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| P500 grit ALO paper P1200 grit ALO paper |
Water | 5-10 lbs | 100/100 rpm | 1 min 1 min |
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| 1 um DIAMAT diamond on ATLANTIS polishing pad |
Water | 5-10 lbs | 100/100 rpm | 2 min | |
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| 0.05 um Nanometer alumina on NAPPAD polishing pad |
5-10 lbs | 100/100 rpm | 1 min | |
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*Required for central polishing force. Click here for more information on central vs. individual polishing force polishing.
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| Tough Pitch Copper, B.F. 100X, Etchant NH4OH / H2O2 |
ETCHING
Common Etchants
CAUTION:Safety is very important when etching. Be sure to wear the appropriate protective clothing and observe all WARNINGS on chemical manufacuters SDS (Safety Data Sheets). Also review the COMMENTS and CONDITIONS Section for each etchant.
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