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PACE Technologies Metallographic Preparation CLASS Chart icon

Smelter Slag
Specimen Preparation (Class 11 Procedures)

Metallographic Class 11 sample preparation
 

Proper microstructural preparation of slags requires proper cutting or sectioning with a fine grit diamond blade (Figure 1 and 2). If the slag (glass) is chipped or excessively cracked during sectioning it may be impossible to remove the damage.

Planar grinding is best accomplished with a semi-fixed diamond on a metal mesh cloth. Intermediate grinding and polishing is accomplished by combining the mechanical component of diamond abrasives with the chemical polishing effect of colloidal silica. Final polishing on a resilient polishing pad such as BLACK CHEM using SIAMAT colloidal silica produces a damage free surface ready for examination (Figure 3).

SECTIONING

Diamond Wafering blade - fine grit / low concentration)

MOUNTING

Castable Mounting with Epoxy or Acrylic resins

POLISHING

Abrasive/surface Lubricant Force/ sample Speed
(Head/base)
Time Individual
Force mode
Central Force
mode
70 micron diamond grinding disk*
Water 5-10 lbs 200/200 rpm Planar
  Metallographic central polishing force
30 um DIAMAT diamond
suspension on CERMESH Metal
Mesh cloth
  5-10 lbs 200/200 rpm 5 min Metallographic individual polishing force Metallographic central polishing force
6 um DIAMAT diamond
on TEXPAN polishing pad
SIAMAT
colloidal silica
10 lbs 200/200 rpm 5 min Metallographic individual polishing force Metallographic central polishing force
1 um DIAMAT diamond
on GOLDPAD or ATLANTIS
polishing pad
SIAMAT
colloidal silica
10 lbs 200/200 rpm 5 min Metallographic individual polishing force Metallographic central polishing force
SIAMAT Colloidal silca
on TEXPAN polishing pad
  10 lbs 200/200 rpm 5 min Metallographic individual polishing force Metallographic central polishing force

*Required for central polishing force. Click here for more information on central vs. individual polishing force polishing.

Metallographic cutting with fine grit diamond wafering blade Metallographic diamond cutting with incorrect wafering blade
Fine grit diamond wafering blade Medium grit diamond wafering blade
Metallographic micrograph of slag
Slag, 100X (Polarized light), as polished condition

ETCHING

Common Etchants
PACE Technologies Recommended Etchants

PACE Technologies Etchant Database

CAUTION:Safety is very important when etching. Be sure to wear the appropriate protective clothing and observe all WARNINGS on chemical manufacuters SDS (Safety Data Sheets). Also review the COMMENTS and CONDITIONS Section for each etchant.


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