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Polycrystalline NANOMETER Alumina
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Fine Alumina Polishing Powder
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Electronics Deagglomerated Polishing Slurry
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NANO Alumina Polishing Slurry
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Colloidal Silica Suspensions
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Chemical Mechanical (CMP) Polishing Suspensions
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Alumina Polishing:
NANOMETER Alumina: RECOMMENEDED for final polishing. This is a polycrystalline alumina abrasive with a more controlled particle size distribution and harder alpha alumina crystal.
Deagglomerated Alumina: Special processing used to breakdown agglomeration. The most common traditional polishing alumina abrasive.
NANO Slurries: Lower cost alumina polishes - useful for harder materials
Calcined Alumina Powders: Very common alumina polishing abrasives
Chemical Mechanical (CMP) Polishing:
Colloidal Silica: Very useful for polishing ceramics, glass and minerals.
CMP Slurry: A mixture of polycrystalline alumina and colloidal silica, provides faster polishing and less polishing relief on metals as compared to colloidal silica alone
