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Metallographic Final Polishing Abrasives

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Metallographic Polycrystalline NANOMETER Alumina
Polycrystalline NANOMETER Alumina
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Metallographic Fine Alumina Polishing Powder
Fine Alumina Polishing Powder
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Metallographic Electronics Deagglomerated Polishing Slurry
Electronics Deagglomerated Polishing Slurry
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Metallographic NANO Alumina Polishing Slurry
NANO Alumina Polishing Slurry
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Metallographic Colloidal Silica Suspensions
Colloidal Silica Suspensions
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Metallographic CMP Polishing Suspensions
Chemical Mechanical (CMP) Polishing Suspensions

Alumina Polishing:

NANOMETER Alumina: RECOMMENEDED for final polishing. This is a polycrystalline alumina abrasive with a more controlled particle size distribution and harder alpha alumina crystal.

Deagglomerated Alumina: Special processing used to breakdown agglomeration. The most common traditional polishing alumina abrasive.

NANO Slurries: Lower cost alumina polishes - useful for harder materials

Calcined Alumina Powders: Very common alumina polishing abrasives

Chemical Mechanical (CMP) Polishing:

Colloidal Silica: Very useful for polishing ceramics, glass and minerals.

CMP Slurry: A mixture of polycrystalline alumina and colloidal silica, provides faster polishing and less polishing relief on metals as compared to colloidal silica alone

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