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Consumables Navigation
Abrasive Sectioning
Precision Wafering
Compression Mounting
Castable Mounting
SiC Grinding
Alumina Papers
Zirconia Abrasives
Diamond Grinding
Lapping Films
Belts, Rolls, SiC Powders
Polishing Pads
Polycrystalline Diamond Abrasives
Monocrystalline Diamond Abrasives
Final Polishing Abrasives
Etching
Cleaning
Hardness Testing Consumables
Metallographic Precision Cutting
1 / 5
Precision Wafering Blades
Diamond and/or CBN Abrasives)
2 / 5
Precision Wafering Blades
with Stainless Steel Core
3 / 5
Electroplated Diamond Blades
(soft / gummy materials)
4 / 5
Precision Cutting
Abrasive Blades
5 / 5
DIACUT Cutting Fluid
with anticorrosion formulation
Wafering Blades Characteristics
Abrasives:
-Diamond - Hardest know abrasive excellent for most materials (not recommended for heat treated steels)
-Cubic Boron Nitride (CBN) - 2nd hardness known abrasive used for cutting heat treated steels
-Hydrid: Combination of diamond and CBN. Useful for all materials
Abrasive Concentration:
-Low Concentration: Recommended for cutting ceramics, glass and minerals
-High Concentration: Recommended for cutting metals and composite materials
Abrasvie Size
-Fine grit: 15 micron abrasive for cutting brittle and easy to chip / fracture materials such as silicon chips and glass
-Mediaum grit: 70 micron abrasive for cutting more ductile materials
Blade Core Material:
-Steel core with copper flash: most common precision wafering blade
-Stainess steel core: more corrosion resistant and economical
Abrasive Bond:
-Pressed: Abrasive is mixed in a powder and pressed at high pressure
-Electroplated: Diamond is plated in a nickel bond. Raised abrasive for coarser cutting. Useful for cutting soft smearable materials
Metallographic Precision Cutting
Dropdown Menu
Locate mouse over the button to open dropdown menu
Blade Diameter ▼
3-inch
4-inch
5-inch
6-inch
7-inch
8-inch
Abrasive Blades / Misc ▼
Abrasive Blades
Miscellaneous
Cutting Fluids ▼
DIACUT Cutting Fluids
See Consumables Selection Table Below
3-inch Diameter (76.2 mm) Wafering Blade
1/2 inch (12.7 mm) Arbor
Application
Quantity
Price
Cat. No.
Additional Info.
Brittle materials
(microelectronics, friable ceramics, minerals)
Low concentration/fine grit diamond
$295.00
WB-0030LC
Hard tougher ceramics
(silicon nitride, zirconia)
Low concentration/ medium grit diamond
$295.00
WB-0035LC
Most metal samples
High concentration/ medium grit diamond
$295.00
WB-0035HC
CBN Wafering Blade
$295.00
WCBN-0035
4-inch Diameter (102 mm) Wafering Blade
1/2 inch (12.7 mm) Arbor
Application
Quantity
Price
Cat. No.
Additional Info.
Brittle materials
(microelectronics, friable ceramics, minerals)
Low concentration/fine grit diamond
$305.00
WB-0040LC
Hard tougher ceramics
(silicon nitride, zirconia)
Low concentration/ medium grit diamond
$305.00
WB-0045LC
Most metal samples
High concentration/ medium grit diamond
$305.00
WB-0045HC
CBN Wafering Blade (medium-grit, high concentration)
$305.00
WCBN-0045
CBN/Diamond Hybrid Wafering Blade (stainless steel core)
$195.00
WB-004GP
Low Concentration Diamond Wafering Blade (stainless steel core)
$195.00
WB-004LCS
High Concentration Diamond Wafering Blade (stainless steel core)
$195.00
WB-004HCS
Electroplated Wafering Blade (course-grit)
$180.00
WB-040EPD
5-inch Diameter (127 mm) Wafering Blade
1/2 inch (12.7 mm) Arbor
Application
Quantity
Price
Cat. No.
Additional Info.
Brittle materials
(microelectronics, friable ceramics, minerals)
Low concentration/ fine grit diamond
$355.00
WB-0050LC
Hard tougher ceramics
(silicon nitride, zirconia)
Low concentration/ medium grit diamond
$355.00
WB-0055LC
Most metal samples
High concentration/ medium grit diamond
$355.00
WB-0055HC
CBN Wafering Blade (medium-grit, high concentration)
$355.00
WCBN-0055
CBN/Diamond Hybrid Wafering Blade (stainless steel core)
$225.00
WB-005GP
Low Concentration Diamond Wafering Blade (stainless steel core)
$225.00
WB-005LCS
High Concentration Diamond Wafering Blade (stainless steel core)
$225.00
WB-005HCS
Electroplated Wafering Blade (course-grit)
$195.00
WB-050EPD
6-inch Diameter (153 mm) Wafering Blade
1/2 inch (12.7 mm) Arbor
Application
Quantity
Price
Cat. No.
Additional Info.
Brittle materials
(microelectronics, friable ceramics, minerals)
Low concentration/ fine grit diamond
$440.00
WB-0060LC
Hard tougher ceramics
(silicon nitride, zirconia)
Low concentration/ medium grit diamond
$440.00
WB-0065LC
Most metal samples
High concentration/ medium grit diamond
$440.00
WB-0065HC
CBN Wafering Blade (medium-grit, high concentration)
$440.00
WCBN-0065
CBN/Diamond Hybrid Wafering Blade (stainless steel core)
$295.00
WB-006GP
Low Concentration Diamond Wafering Blade (stainless steel core)
$295.00
WB-006LCS
High Concentration Diamond Wafering Blade (stainless steel core)
$295.00
WB-006HCS
Electroplated Wafering Blade (course-grit)
$215.00
WB-060EPD
7-inch Diameter (178 mm) Wafering Blade
1/2 inch (12.7 mm) Arbor
Application
Quantity
Price
Cat. No.
Additional Info.
Brittle materials
(microelectronics, friable ceramics, minerals)
Low concentration/ fine grit diamond
$575.00
WB-0070LC
Hard tougher ceramics
(silicon nitride, zirconia)
Low concentration/ medium grit diamond
$575.00
WB-0075LC
Most metal samples
High concentration/ medium grit diamond
$575.00
WB-0075HC
CBN Wafering Blade (medium-grit, high concentration)
$575.00
WCBN-0075
CBN/Diamond Hybrid Wafering Blade (stainless steel core)
$360.00
WB-007GP
Low Concentration Diamond Wafering Blade (stainless steel core)
$360.00
WB-007LCS
High Concentration Diamond Wafering Blade (stainless steel core)
$360.00
WB-007HCS
Electroplated Wafering Blade (course-grit)
$235.00
WB-070EPD
8-inch Diameter (203 mm) Wafering Blade
1/2 inch (12.7 mm) Arbor
Application
Quantity
Price
Cat. No.
Additional Info.
Brittle materials
(microelectronics, friable ceramics, minerals)
Low concentration/ fine grit diamond
$590.00
WB-0080LC
Hard tougher ceramics
(silicon nitride, zirconia)
Low concentration/ medium grit diamond
$590.00
WB-0085LC
Most metal samples
High concentration/ medium grit diamond
$590.00
WB-0085HC
CBN Wafering Blade (medium-grit, high concentration)
$590.00
WCBN-0085
CBN/Diamond Hybrid Wafering Blade (stainless steel core)
$415.00
WB-008GP
Low Concentration Diamond Wafering Blade (stainless steel core)
$415.00
WB-008LCS
High Concentration Diamond Wafering Blade (stainless steel core)
$415.00
WB-008HCS
Electroplated Wafering Blade (course-grit)
$295.00
WB-080EPD
Diamond Wafer Cutting Fluids
Application
Quantity
Price
Cat. No.
Additional Info.
DIACUT Dressing Stick (1/2 x 1/2 x 4-1/2-inch)
$13.75
DRESS-0010
DIACUT Water-based wafer cutting fluid (16 oz)
$11.50
WL-3000-16
DIACUT Water-based wafer cutting fluid (32 oz)
$21.50
WL-3000-32
DIACUT 2 Water-based wafer cutting fluid with
anti-corrosion additive (16 oz)
$11.50
WL2-3000-16
DIACUT 2 Water-based wafer cutting fluid with
anti-corrosion additive (32 oz)
$21.50
WL2-3000-32
DIACUT Oil-based wafer cutting fluid (16 oz)
$11.50
OL-3000-16
DIACUT Oil-based wafer cutting fluid (32 oz)
$21.50
OL-3000-32
Propylene Glycol Based Anti-Corrosion Additive (32 oz)
$26.50
PCC-5000-32
MAXCUT ABRASIVE BLADES
1/2 inch (12.7 mm) Arbor, 10 per package
Application
Quantity
Price
Cat. No.
Additional Info.
Alumina abrasive blade (7-inch with 1/2-inch arbor)
$195.00
MAX-7000S
Alumina abrasive blade (6-inch with 1/2-inch arbor)
$145.00
MAX-D150
SiC abrasive blade (6-inch with 1/2-inch arbor)
$145.00
MAX-C150
Miscellaneous
Application
Quantity
Price
Cat. No.
Additional Info.
Wafering blade dressing sticks (medium grit) (1/pkg)
$13.75
DRES-0010
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AZ (8.5%)
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OH (7.75%)
SC (8.5%)
VA (9.0%)
WI (6.0%)
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