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Electronic Materials Metallographic Preparation
(Class 4 Procedures)

PACE Technologies Class 4 materials chart

Description:

Electronic and microelectronic materials are composed of a wide variety of materials, ranging from Pb-Sn solders to ceramic packages which have both soft and very hard materials.

Typical Material
Package Component
Physical Properties
Alumina, Aluminum Nitride,
Beryllium oxide
Packing body
Hard, brittle
Au / Si
Die attach
Soft
Ni/Fe/Co
Leads/lids
Tough, ductile
Au and/or Ni
Plating
Soft, ductile
Silicon
IC chip
Brittle
Ag/Cu
Lead braze
Soft, ductile
Pb/Sn
Solder
Soft
Tungsten
Coating refractory
Hard, tough
Aluminum
Bonded Wires
Soft

Preparation Challenge:

These materials require minimizing the amount of damaged produced during sectioning as well as polishing process which maintain the integrity of the specimens different hardness components.

Examples:

Silicon MicroeletronicsMetallographic micrograph of ceramic package

  GaAs MicroeletronicsMetallographic micrograph of GaAs

BeO SubstratesMetallographic micrograph of BeO ceramic package

  AlN substrates
Metallographic image of AlN electronic package

Multilayer Ceramic capacitorsMetallographic micrograph of muli-layer barium titinate ceramic capacitor

  Ferrites
Metallographic micrograph of Ni-Fe ferrite

Solder joints non-ceramic substrate
Metallographic micrograph of electronic solder joint

  PZT DevicesPZT Devices

MEMS Devices
MEMS Devices

   

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