Electronic Components
Description:
Electronic and microelectronic materials are composed of a wide variety of materials, ranging from Pb-Sn solders to ceramic packages which have both soft and very hard materials.
Typical Material
|
Package Component
|
Physical Properties
|
Alumina, Aluminum Nitride, Beryllium oxide |
Packing body
|
Hard, brittle
|
Au / Si
|
Die attach
|
Soft
|
Ni/Fe/Co
|
Leads/lids
|
Tough, ductile
|
Au and/or Ni
|
Plating
|
Soft, ductile
|
Silicon
|
IC chip
|
Brittle
|
Ag/Cu
|
Lead braze
|
Soft, ductile
|
Pb/Sn
|
Solder
|
Soft
|
Tungsten
|
Coating refractory
|
Hard, tough
|
Aluminum
|
Bonded Wires
|
Soft
|
Preparation Challenge:
These materials require minimizing the amount of damaged produced during sectioning as well as polishing process which maintain the integrity of the specimens different hardness components.
