Electronic and microelectronic materials are composed of a wide variety of materials, ranging from Pb-Sn solders to ceramic packages which have both soft and very hard materials.
|Typical Material||Package Component||Physical Properties|
|Alumina, Aluminum Nitride,
|Packing body||Hard, brittle|
|Au / Si||Die attach||Soft|
|Au and/or Ni||Plating||Soft, ductile|
|Ag/Cu||Lead braze||Soft, ductile|
|Tungsten||Coating refractory||Hard, tough|
These materials require minimizing the amount of damaged produced during sectioning as well as polishing process which maintain the integrity of the specimens different hardness components.
|ELECTRONIC COMPONENT PROCEDURES|
|Multilayer Ceramic capacitors
|Solder joints non-ceramic substrate