
Class 1: Soft, Ductile
Soft, gummy metals that smear easily. Etchants must reveal structure without aggressive attack.
Also in this classMagnesium, lead, polymer matrix composites
Reagents & reference
Reveal microstructure with the right reagent. Guides by material, application methods, and safety practice in one place.
Widely-used metallographic reagents grouped by material family. Click any name for its full entry: composition, target structure, hazards, and usage notes.
General microstructure, ferrite, pearlite, martensite.
Austenite, ferrite, delta-ferrite, sigma phase, carbides.
Grain structure, intermetallics, eutectic phases.
Grain boundaries, twinning, alpha-beta phases, color contrast.
Alpha and beta phases, transformation products.
Gamma matrix, gamma prime, carbides, segregation.
Graphite morphology, matrix structure, carbides.
Tungsten, molybdenum, tantalum, niobium. Grain structure and carbides.
WC-Co, TiC-Ni. Binder phase, carbide morphology, porosity.
What etching reveals, how the techniques differ, how to apply a reagent, and how to handle them safely. Four pieces of the same practice.
Etchants chemically attack constituents in a polished sample to expose grain boundaries, phase regions, precipitates, and structural anomalies that are otherwise invisible.
Grain structure, shape, size, and phase distribution become visible. The properties of the material are written into these features.
Selective chemistry distinguishes ferrite from pearlite, martensite from austenite, or carbide networks from base matrices.
Etched surfaces gain optical contrast for brightfield, polarized light, and DIC. Without it many features simply do not image.
Discontinuities, segregation zones, and heat-affected regions become readable in fractured or worn components.
Chemical and electrolytic methods cover most cases. Thermal, plasma, molten salt, and magnetic etching address materials or feature scales the dominant techniques cannot reach.
Acid or base solutions with oxidizers or reducers, usually in alcohol. The reagent dissolves boundaries and phases by reaction alone. Most common technique.
Voltage or current accelerates and controls the reaction. Used for stainless, titanium, and aluminum where chemistry alone is too slow or uneven.
Heating in inert or reducing atmosphere grooves grain boundaries through evaporation and surface diffusion. For ceramics and refractory metals.
Reactive gas plasma in vacuum attacks the surface at feature scale. Used for semiconductors, thin films, and MEMS devices.
Immersion in NaOH, KOH, or NaCl at elevated temperature. Reveals refractory metals, oxides, and ceramics that resist conventional attack.
Ferromagnetic colloidal particles align along domain boundaries to make them visible. For steels, ferrites, and magnetic alloys only.
Method depends on etchant aggressiveness, sample geometry, and the surface area you need to treat. Most procedures use immersion or swab.
Submerge the polished face for a controlled time, rinse, dry. Predictable timing, but uses more reagent than swab.
Saturate a cotton ball or cloth and wipe the surface. Good for aggressive reagents that need short contact, or treating a small region.
Sample acts as the anode in a conductive bath under controlled voltage and current. Common for stainless, titanium, and aluminum (Barker’s).
A single drop, sometimes warmed, applied and rinsed. For tint etchants like Klemm’s and Beraha’s that deposit interference films.
Most metallographic etchants are strong acids, bases, or oxidizers; some are toxic, flammable, or both. Plan PPE, ventilation, storage, and disposal before mixing the first batch.
Chemical-resistant gloves (nitrile, neoprene, or heavier weight for HF), splash goggles, lab coat, closed-toe shoes. Add a face shield for concentrated acids.
Mix and apply in a fume hood. HCl, HNO3, HF, and ammonia escape standard bench exhaust.
Compatible bottles, tight seals, labels with contents, concentration, and date. Segregate by hazard class.
Never down the drain. Collect in labeled hazardous waste containers. Picric acid and HF need special handling.
The 11 prep classes group materials by how they behave during sample preparation. Pick a class to see which materials it covers and drill into the relevant etchant guide.

Soft, gummy metals that smear easily. Etchants must reveal structure without aggressive attack.
Also in this classMagnesium, lead, polymer matrix composites

High-melting-point metals with hard oxide films. Often need electrolytic or specialized chemical etchants.
Materials in this classTungsten, molybdenum, tantalum, niobium, rhenium, hafnium, zirconium, beryllium

Brittle behavior at room temperature; pull-out and edge retention are the big challenges.
Also in this classPowder metallurgy, sintered alloys

Layered, fragile structures where chemical compatibility matters as much as mechanical response.
Materials in this classMultilayer ceramic capacitors (MLCCs), MEMS, semiconductors, functional ceramics

The workhorse class, with predictable response to standard chemical etchants like nital and glyceregia.
Also in this classAnnealed structural steels

Corrosion-resistant alloys that resist mild etchants; often require aggressive or electrolytic reagents.
Also in this classCobalt alloys, high-temperature alloys

Multilayer systems where each layer may need a different etchant to reveal porosity, bond, and substrate.
Materials in this classThermal spray coatings (WC-Co, NiCr, YSZ), hard chrome plating, anodized and galvanized coatings

Heat-treated steels where etching reveals martensite, retained austenite, and case-depth gradients.
Also in this classCase-hardened steels, through-hardened steels

Reinforcement and matrix respond differently. Etchants must balance contrast without preferential attack.
Materials in this classAl-SiC, Mg-Al₂O₃, Ti-B₄C composites; fiber-reinforced and high-temperature MMCs

Often etched chemically or thermally to reveal grain boundaries that polishing alone won't expose.
Also in this classAdvanced engineered ceramics

Cermets and technical glasses. Etching is often supplementary to specialized polishing techniques.
Materials in this classCermets (WC, TiC-Ni), technical glasses, minerals
Common questions about metallographic etching
Chemical etching uses acid or base solutions combined with oxidizers or reducers in a solvent (typically alcohol) to reveal microstructure through selective dissolution. The process relies solely on chemical reactions between the etchant and the sample surface. Electrolytic etching enhances this process by applying voltage or current, which accelerates the etching reaction and provides more control over the depth and selectivity of etching. Electrolytic methods are particularly useful for stainless steels, titanium alloys, and materials requiring precise phase differentiation.
Selecting the correct etchant depends on your material type, desired microstructural features, and analysis objectives. Start with industry-standard etchants for your material family: Nital for carbon steels, Keller's for aluminum alloys, Kroll's for titanium, or Marble's for nickel alloys. Consider whether you need general microstructure revelation or specific phase contrast. Browse the material-specific guides on this page, or use the Etchant Selector tool, to match your material composition with proven formulations. Always test on a sacrificial sample first to verify results before etching critical specimens.
Always wear appropriate personal protective equipment including chemical-resistant gloves, safety glasses, and lab coat when handling etchants. Work in a well-ventilated fume hood to avoid inhaling vapors, especially with acid-based etchants. Store etchants in clearly labeled, chemically compatible containers away from incompatible materials. Have neutralizing agents and safety equipment readily available. Never mix etchants unless specified by the procedure. Dispose of used etchants according to local environmental regulations. Familiarize yourself with the Safety Data Sheet (SDS) for each etchant before use.
Etching time varies widely based on material, etchant concentration, temperature, and desired results, ranging from seconds to several minutes. Begin with short intervals (5-10 seconds for aggressive etchants, 30-60 seconds for mild ones) and examine under a microscope. Progressively increase time in small increments until optimal contrast is achieved. Over-etching can obscure features or create artifacts, while under-etching may not reveal sufficient detail. Swab etching typically requires less time than immersion. Record successful etching parameters for reproducibility. Experience with specific material-etchant combinations will improve your timing precision.
Yes, samples can typically be re-etched if the initial results are unsatisfactory. If under-etched, simply re-apply the etchant for additional time. If over-etched, you must re-polish the surface through the final polishing steps to remove the over-etched layer, then etch again with reduced time. Clean the sample thoroughly between attempts to remove residual etchant. For electrolytic etching, you can often reverse mild over-etching by briefly reversing the polarity. Keep detailed notes of each attempt to refine your technique. Multiple re-polishing cycles may reduce sample thickness, so plan accordingly for critical specimens.
Store etchants in tightly sealed, chemically resistant bottles with clear labels indicating contents, concentration, and preparation date. Keep in a cool, dry, well-ventilated area away from heat sources and incompatible chemicals. Many etchants degrade over time. Check for discoloration or precipitates before use and replace as needed. For disposal, never pour etchants down the drain. Collect used etchants in designated waste containers based on chemical compatibility. Follow your institution's hazardous waste disposal procedures and local environmental regulations. Some etchants may require neutralization before disposal. Maintain a chemical inventory and waste log for safety compliance.